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公开(公告)号：EP1983528A4
公开(公告)日：2015-07-29
申请号：EP07706716
申请日：2007-01-09
发明人： SATO KIMITAKA , HISAEDA YUTAKA , OKANO TAKU , OGI KOZO
IPC分类号： H01B5/14 , C23C18/08 , H01B13/00 , H01L31/0224 , H01L31/0392
CPC分类号： H01L31/022425 , C23C18/08 , H01L31/0392 , Y02E10/50 , Y10T428/24413
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公开(公告)号：EP2645408A4
公开(公告)日：2016-06-08
申请号：EP11842826
申请日：2011-05-13
发明人： KURITA SATORU , ENDOH KEIICHI , SAITO YU , HISAEDA YUTAKA , UEYAMA TOSHIHIKO
IPC分类号： H01L21/60 , B22F1/00 , B23K1/00 , B23K20/00 , B23K35/02 , B23K101/36 , B32B3/26 , B32B15/01 , H01L23/00 , H05K3/32
CPC分类号： B23K31/02 , B22F1/0014 , B22F1/0062 , B22F1/0096 , B22F2999/00 , B23K1/0016 , B23K20/00 , B23K35/025 , B23K2201/36 , B32B3/26 , B32B15/018 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05639 , H01L2224/27318 , H01L2224/2732 , H01L2224/27505 , H01L2224/2929 , H01L2224/29294 , H01L2224/29339 , H01L2224/2939 , H01L2224/2949 , H01L2224/32225 , H01L2224/83075 , H01L2224/83192 , H01L2224/83204 , H01L2224/83439 , H01L2224/83801 , H01L2224/8384 , H01L2224/83907 , H01L2224/83986 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/203 , Y10T428/12479 , H01L2224/832 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0665 , B22F1/0018 , H01L2924/0002
摘要： There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.
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公开(公告)号：EP2455179A4
公开(公告)日：2017-05-10
申请号：EP09847300
申请日：2009-10-23
发明人： ENDOH KEIICHI , NAGAHARA AIKO , HISAEDA YUTAKA , UEYAMA TOSHIHIKO
CPC分类号： B23K35/3006 , B22F1/0018 , B22F1/0062 , B22F2999/00 , B23K35/0244 , B23K35/22 , B23K35/365 , B23K35/40 , B82Y30/00 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12044 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/203 , Y10T428/2991 , B22F2301/255 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/0002
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公开(公告)号：EP2548678A4
公开(公告)日：2015-11-25
申请号：EP10847952
申请日：2010-04-23
IPC分类号： B22F1/00 , B22F1/02 , B22F7/06 , B22F9/24 , B23K1/00 , B23K35/00 , B23K35/36 , B82Y30/00 , C22C5/06 , H01B1/02 , H01L21/52 , H01L23/00 , H05K3/32
CPC分类号： H01L24/83 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F7/064 , B22F9/24 , B22F2301/255 , B22F2303/01 , B22F2304/054 , B22F2304/056 , B22F2999/00 , B23K1/0008 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K35/025 , B23K35/3006 , B23K35/36 , B23K35/3618 , B23K2201/42 , B82Y30/00 , C09J11/06 , C22C5/06 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/29139 , H01L2224/29339 , H01L2224/2949 , H01L2224/32145 , H01L2224/32221 , H01L2224/83011 , H01L2224/83048 , H01L2224/83075 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/203 , H05K3/32 , H05K3/3489 , H05K2201/0257 , H05K2203/086 , H05K2203/1131 , H01L2224/2919 , H01L2924/00 , H01L2924/3512 , H01L2924/0002
摘要： A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300°C or lower.
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5.发明公开
公开(公告)号：EP2581156A4
公开(公告)日：2015-02-25
申请号：EP11792572
申请日：2011-06-10
IPC分类号： B22F9/00 , B22F1/00 , B22F1/02 , B82Y30/00 , C22C5/06 , H01B1/00 , H01B1/22 , H01L21/52 , H01L23/00 , H05K3/32 , H05K3/34
CPC分类号： C09J1/00 , B22F1/0018 , B22F1/0062 , B22F2303/10 , B22F2998/00 , B32B37/12 , B82Y30/00 , C22C5/06 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29299 , H01L2224/29339 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H05K3/32 , H05K3/3463 , H05K2201/0224 , H05K2201/0257 , H05K2203/1131 , B22F2303/01 , B22F2301/255 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/2929
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6.发明公开
公开(公告)号：EP2208559A4
公开(公告)日：2011-08-10
申请号：EP08843155
申请日：2008-10-23
发明人： HISAEDA YUTAKA , UEYAMA TOSHIHIKO
CPC分类号： H01B1/22 , B22F1/0022 , B22F1/0059 , B22F1/0096 , B22F9/24 , B82Y30/00 , C01P2004/03 , C01P2004/04 , C01P2004/64 , C01P2006/11 , C01P2006/12 , C09C1/62 , H01B1/02 , H05K1/092
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7.发明公开METAL MICROPARTICLE CONTAINING COMPOSITION AND PROCESS FOR PRODUCTION OF THE SAME 审中-公开金属微粒含有组合物和方法及其
公开(公告)号：EP2311586A4
公开(公告)日：2015-06-03
申请号：EP08792313
申请日：2008-08-07
发明人： IHA KOSUKE , HISAEDA YUTAKA , UEYAMA TOSHIHIKO
CPC分类号： B22F1/0018 , B22F9/24 , B82Y30/00 , H05K1/097 , H05K2203/1131 , Y10T428/2982
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8.发明公开SILVER MICROPARTICLE POWDER, METHOD FOR PRODUCING SAID POWDER, SILVER PASTE USING SAID POWDER, AND METHOD FOR USING SAID PASTE 审中-公开银微粒粉末，工艺用于生产金粉，银粉膏粉及其使用方法膏体
公开(公告)号：EP2377633A4
公开(公告)日：2014-03-26
申请号：EP09834511
申请日：2009-12-25
IPC分类号： B22F9/24 , B22F1/00 , B22F1/02 , B22F9/00 , B82Y30/00 , B82Y40/00 , B82Y99/00 , C09C1/62 , C09C3/06 , C09C3/08 , C09D5/24 , C09D17/00 , C22C5/08 , H01B1/22 , H01B5/00 , H01B13/00 , H01M4/38
CPC分类号： H01B1/02 , B22F1/0014 , B22F1/0018 , B22F1/0022 , B22F1/0062 , B22F1/0074 , B22F9/24 , B82Y30/00 , C01P2004/04 , C01P2004/64 , C01P2006/11 , C01P2006/12 , C09C1/62 , C09D5/24 , C09D17/006 , C22C5/06 , C22C5/08 , H01B1/16 , H01B1/22 , H01M4/38
摘要： A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (D TEM ) of 5 to 100 nm as measured using a transmission electron microscope.
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公开(公告)号：EP2116320A4
公开(公告)日：2013-10-09
申请号：EP07714733
申请日：2007-02-15
发明人： SATO KIMITAKA , HISAEDA YUTAKA
IPC分类号： B22F9/24 , B22F1/00 , H01L21/28 , H01L21/288
CPC分类号： H01L21/76838 , B22F1/0022 , B22F9/24 , B82Y30/00 , H01L21/288 , Y10T428/24413 , Y10T428/2982
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公开(公告)号：EP2067551A4
公开(公告)日：2010-08-18
申请号：EP07807431
申请日：2007-09-11
发明人： OGI KOZO , HISAEDA YUTAKA
IPC分类号： B22F1/02 , B22F1/00 , B22F9/24 , C09C1/62 , C09C3/08 , C09D1/00 , C09D5/24 , H01B1/22 , H01B5/00 , H01B13/00 , H01L21/28 , H01L21/288
CPC分类号： H01B1/22 , B22F1/0022 , B22F1/0062 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/88 , C01P2004/04 , C01P2004/64 , C01P2006/32 , C01P2006/40 , C08K3/08 , C08K9/04 , C09C1/62 , C09C3/08 , C09D5/24 , C09D7/62 , C09D7/67 , H01B1/02 , H05K1/092
摘要： A silver particle composite powder produced by mixing a silver particle powder (A) which bears on the surface of each silver particle, an organic protective layer comprising an amine compound having at least one unsaturated bond in one molecule and having a molecular weight of from 100 to 1000, and has a mean particle diameter D TEM , as determined by TEM, of at most 50 nm and a silver particle powder (B) which bears on the surface of each silver particle, an organic protective layer comprising a fatty acid having a molecular weight of from 100 to 1000 and an amine compound having a molecular weight of from 100 to 1000 with at least any one of the fatty acid and the amine compound having at least one unsaturated bond in one molecule, and has a mean particle diameter D TEM of at most 50 nm, in a blend ratio by mass, A/B of from 3/1 to 1/3 in terms of silver.
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