公开(公告)号：EP2548678A4

公开(公告)日：2015-11-25

申请号：EP10847952

申请日：2010-04-23

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  HISAEDA YUTAKA ,  MIYAZAWA AKIHIRO ,  NAGAHARA AIKO ,  UEYAMA TOSHIHIKO

IPC: B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  B22F9/24 ,  B23K1/00 ,  B23K35/00 ,  B23K35/36 ,  B82Y30/00 ,  C22C5/06 ,  H01B1/02 ,  H01L21/52 ,  H01L23/00 ,  H05K3/32

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2201/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0002

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300°C or lower.

公开(公告)号：EP3012048A4

公开(公告)日：2017-03-08

申请号：EP14814197

申请日：2014-06-19

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  NAGAOKA MINAMI ,  KURITA SATORU ,  MIYOSHI HIROMASA ,  KOHNO YOSHIKO ,  MIYAZAWA AKIHIRO

IPC: B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  H05K3/32

CPC classification number: B23K35/3006 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F1/0074 ,  B22F7/064 ,  B22F2301/255 ,  B22F2303/40 ,  B22F2304/05 ,  B23K1/0008 ,  B23K35/025 ,  H05K3/3484

Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7 % by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2 % by weight of an acid dispersant and 0.01 to 0.1 % by weight of phosphate ester dispersant; and 0.01 to 0.1% by weight of a sintering aid, such as diglycolic acid, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60 % by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90 % by weight.

公开(公告)号：EP2581156A4

公开(公告)日：2015-02-25

申请号：EP11792572

申请日：2011-06-10

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  HISAEDA YUTAKA ,  MIYAZAWA AKIHIRO ,  NAGAHARA AIKO ,  UEYAMA TOSHIHIKO

IPC: B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  B82Y30/00 ,  C22C5/06 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34

CPC classification number: C09J1/00 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2303/10 ,  B22F2998/00 ,  B32B37/12 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K3/32 ,  H05K3/3463 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1131 ,  B22F2303/01 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929