发明公开
EP2572788A1 Method and device for thermal insulation of micro-reactors
有权
Verfahren und Vorrichtung zurWärmeisolierungvon Mikroreaktoren
- 专利标题： Method and device for thermal insulation of micro-reactors
- 专利标题（中）： Verfahren und Vorrichtung zurWärmeisolierungvon Mikroreaktoren
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申请号： EP11182533.7申请日： 2011-09-23
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公开(公告)号： EP2572788A1公开(公告)日： 2013-03-27
- 发明人: Jones, Ben , Fiorini, Paolo , Tanaka, Hiroyuki
- 申请人： IMEC , Katholieke Universiteit Leuven K.U. Leuven R&D , Panasonic Corporation
- 申请人地址： Kapeldreef 75 3001 Leuven BE
- 专利权人： IMEC,Katholieke Universiteit Leuven K.U. Leuven R&D,Panasonic Corporation
- 当前专利权人： IMEC,Katholieke Universiteit Leuven K.U. Leuven R&D,Panasonic Corporation
- 当前专利权人地址： Kapeldreef 75 3001 Leuven BE
- 代理机构： Hertoghe, Kris Angèle Louisa
- 主分类号： B01L7/00
- IPC分类号： B01L7/00 ; B01L3/00 ; B81C1/00
摘要：
The present invention provides a micro-fluidic device (104), comprising:
- a semiconductor substrate;
- at least one micro-reactor (105) in said semiconductor substrate;
- one or more micro-fluidic channels (101) in said semiconductor substrate, connected to said at least one micro-reactor (105);
- a cover layer (106) bonded to the semiconductor substrate (900) for sealing the one or more micro-fluidic channels (101); and
- at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).
- a semiconductor substrate;
- at least one micro-reactor (105) in said semiconductor substrate;
- one or more micro-fluidic channels (101) in said semiconductor substrate, connected to said at least one micro-reactor (105);
- a cover layer (106) bonded to the semiconductor substrate (900) for sealing the one or more micro-fluidic channels (101); and
- at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).
公开/授权文献
- EP2572788B1 Method and device for thermal insulation of micro-reactors 公开/授权日：2015-03-18
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