Disclosed are a multilayer styrenic resin sheet comprising 10 to 50 laminated layers which are each made of a styrenic resin composition that comprises 29 to 65 mass% of a styrene/conjugated diene copolymer (A), 51 to 15 mass% of a polystyrene resin (B) and 20 to 9 mass% of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 um; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220 °C is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass% relative to 100 mass% of the copolymer (A).