公开(公告)号：EP2626203A1

公开(公告)日：2013-08-14

申请号：EP11830739.6

申请日：2011-10-06

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： AOKI Yutaka ,  TAKEI Atsushi ,  HIROKAWA Yasushi ,  MASUDA Yusuke

IPC分类号： B32B27/18 ,  B65D73/02 ,  H01B5/14

CPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/302 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/05 ,  B32B2307/202 ,  B65D73/02 ,  B65D2213/02 ,  Y10T428/24975

摘要： The present invention provides a surface conductive thermoplastic resin sheet and a molded member, such as an embossed carrier tape, using the sheet, in which burr- and flash-related faults are prevented, whatever the molding equipment, by a slitting method or punching when embossing. Provided is a conductive multilayered sheet, and an electronic component package, a carrier tape and a tray consisting of the conductive multilayered sheet, wherein respective layers with a mean thickness of 2 to 50 µm are composed of a thermoplastic resin (A), or a resin composition having the thermoplastic resin (A) as a main component, and wherein a conductive resin layer consisting of 65 to 95 wt% of a thermoplastic resin (B), or a resin composition having the thermoplastic resin (B) as a main component, and 5 to 35 wt% of carbon black, on one side or both sides of the base sheet consisting of multiple layers wherein 10 to 50 respective layers are layered.

公开(公告)号：EP2666630B1

公开(公告)日：2015-03-04

申请号：EP12737118.5

申请日：2012-01-16

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： AOKI Yutaka ,  TAKEI Atsushi ,  HIROKAWA Yasushi ,  MASUDA Yusuke

IPC分类号： B32B27/30 ,  B65D65/40 ,  B65D73/02 ,  B65D85/86 ,  C08L25/06 ,  C08L51/04 ,  C08L53/02

CPC分类号： H01L21/673 ,  B32B27/08 ,  B32B27/302 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2439/00 ,  B32B2553/00 ,  B65D2585/86 ,  C08L53/02 ,  C08L2205/02 ,  H01L21/67336 ,  Y10T428/1352 ,  Y10T428/24975 ,  C08L25/06

公开(公告)号：EP2666630A1

公开(公告)日：2013-11-27

申请号：EP12737118.5

申请日：2012-01-16

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： AOKI Yutaka ,  TAKEI Atsushi ,  HIROKAWA Yasushi ,  MASUDA Yusuke

IPC分类号： B32B27/30 ,  B65D65/40 ,  B65D73/02 ,  B65D85/86 ,  C08L25/06 ,  C08L51/04 ,  C08L53/02

CPC分类号： H01L21/673 ,  B32B27/08 ,  B32B27/302 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2439/00 ,  B32B2553/00 ,  B65D2585/86 ,  C08L53/02 ,  C08L2205/02 ,  H01L21/67336 ,  Y10T428/1352 ,  Y10T428/24975 ,  C08L25/06

摘要： Disclosed are a multilayer styrenic resin sheet comprising 10 to 50 laminated layers which are each made of a styrenic resin composition that comprises 29 to 65 mass% of a styrene/conjugated diene copolymer (A), 51 to 15 mass% of a polystyrene resin (B) and 20 to 9 mass% of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 um; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220 °C is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass% relative to 100 mass% of the copolymer (A).