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1.发明公开
公开(公告)号：EP4461533A1
公开(公告)日：2024-11-13
申请号：EP23737309.7
申请日：2023-01-06
发明人： ICHIKAWA Toru , SHINOZAKI Kousuke , YOSHIKAWA Katsuyuki , ITO Masahiro , NAGATA Kenji , TONG Naijun
摘要： A packaging bag laminate to be used for a packaging bag, a spout-attached packaging bag, and a content-contained spout-attached packaging bag, includes a base layer (10), an intermediate layer (20), and a sealant layer (30) that are laminated in this order, the base layer (10) is a stretched film made of high density polyethylene, the intermediate layer (20) is a multilayer-coextruded film in which support layers (22, 23) mainly made of polyethylene are laminated on two sides of a gas barrier resin layer (21), and the sealant layer (30) is a film made of one or more materials selected from ethylene homopolymer or ethylene copolymer.
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公开(公告)号：EP4461527A1
公开(公告)日：2024-11-13
申请号：EP22918899.0
申请日：2022-12-28
申请人： Toppan Holdings Inc.
发明人： FURUTA Kaoru , TOKINOYA Osamu , YAMADA Mikinori
摘要： A resin film is laminated thereon a gas barrier layer having gas barrier properties to constitute a laminate for a packaging body. The resin film contains polyethylene terephthalate. In a cross section of the resin film, the softening temperature of the resin film in the width direction and the softening temperature thereof in the flow direction measured by local thermal analysis are in the range of 200°C or more and 254°C or less.
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公开(公告)号：EP4271882B1
公开(公告)日：2024-11-13
申请号：EP21840780.7
申请日：2021-12-28
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公开(公告)号：EP3990699B1
公开(公告)日：2024-11-13
申请号：EP20754355.4
申请日：2020-06-29
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公开(公告)号：EP4444629A1
公开(公告)日：2024-10-16
申请号：EP22905153.7
申请日：2022-12-09
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公开(公告)号：EP4442451A1
公开(公告)日：2024-10-09
申请号：EP22910995.4
申请日：2022-12-12
申请人： Toppan Holdings Inc.
IPC分类号： B32B9/00 , B32B27/10 , B32B27/30 , B32B27/32 , B32B29/00 , B32B29/06 , B65D65/40 , D21H19/08 , D21H19/20 , D21H19/22 , D21H27/30
CPC分类号： B32B9/00 , B32B27/30 , B32B27/32 , B32B27/10 , B32B29/00 , B32B29/06 , B65D65/40 , D21H19/08 , D21H19/20 , D21H19/22 , D21H27/30
摘要： A gas barrier laminate according to one aspect of the present disclosure is a gas barrier laminate including a paper base material, a first resin layer, a vapor-deposited layer, and a second resin layer in this order, in which the gas barrier laminate has a density of 0.9 g/cm3 or higher and 1.5 g/cm3 or lower, and a dimensional change percentage in a CD direction of a dimension under conditions of 40°C and 90%RH with respect to a dimension under conditions of 40°C and 20%RH of the gas barrier laminate is 0.8% or less.
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公开(公告)号：EP4424510A1
公开(公告)日：2024-09-04
申请号：EP22898697.2
申请日：2022-11-28
申请人： Toppan Holdings Inc.
发明人： FUKUGAMI Miki , YAMAKAWA Ikuko , FURUTA Kaoru
摘要： A barrier film according to the first aspect of the present disclosure contains, in the following order: a base material layer containing polypropylene; a vapor deposition layer containing an inorganic oxide; and a gas barrier layer, in which the base material layer has a multilayer structure in which at least three layers, which are a first skin layer, a core layer, and a second skin layer, are provided in this order, and in which when a softening temperature of each of the layers of the base material layer is measured by local thermal analysis (LTA), at least one softening temperature of the first skin layer is 120°C or higher, at least one softening temperature of the core layer is 190°C or higher, and at least one softening temperature of the second skin layer is 160°C or lower.
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公开(公告)号：EP4417419A1
公开(公告)日：2024-08-21
申请号：EP22880997.6
申请日：2022-10-11
发明人： YAMAMOTO, Keiichi , MATSUO, Hiroshi
CPC分类号： B32B27/08 , B32B2250/2420130101 , B32B2439/4620130101 , B32B2307/55820130101 , B32B2439/7020130101 , B32B2307/3020130101 , B32B27/32 , B32B27/34 , B32B2307/7220130101
摘要： To provide a sealant film for retort food packaging containers in which heat resistance at retort temperatures is balanced with impact resistance at low temperatures, or a wide processable temperature range is balanced with impact resistance at low temperatures, at a high level beyond the limits of conventional technologies. The object is accomplished by a sealant film for retort food packaging containers having a seal layer, a core layer, and a laminate layer, each comprising a linear polyethylene, wherein each of said layers has a specific density and/or is polymerized by a specific catalyst, or wherein each of said layers has a specific thermal melting rate at 121°C.
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9.发明公开
公开(公告)号：EP4415145A1
公开(公告)日：2024-08-14
申请号：EP22878600.0
申请日：2022-10-06
发明人： SASAKI, Miho , KATO, Takahiro
IPC分类号： H01M50/342 , B65D65/40 , H01M10/04 , H01M50/105 , H01M50/121 , H01M50/129 , H01M50/184 , H01M50/193 , H01M50/197 , H01M50/198 , H01M50/375
CPC分类号： Y02E60/10 , B65D65/40 , H01M10/04 , H01M50/105 , H01M50/121 , H01M50/129 , H01M50/184 , H01M50/193 , H01M50/197 , H01M50/198 , H01M50/342 , H01M50/375
摘要： Provided is an adhesive film that is used in a power storage device. The power storage device comprises a structure in which a power storage device element is accommodated in a package formed by a power storage device exterior material. The power storage device exterior material is constituted of a laminate including at least a base material layer, a barrier layer, and thermally-fusible resin layers in the stated order from the outside. The thermally-fusible resin layers of the power storage device exterior material are thermally fused together so as to accommodate the power storage device element in the package. The adhesive film is used so as to be interposed between the thermally-fusible resin layers at a position where the thermally-fusible resin layers are thermally fused together. The adhesive film has a multilayer structure, and the adhesive film includes at least one layer having a cross-sectional hardness, as measured in an environment at a temperature of 110°C, of 15 N/mm2 or greater. In addition, the adhesive film includes at least one resin layer L having a melting peak temperature of 100-135°C.
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10.发明公开
公开(公告)号：EP4415135A1
公开(公告)日：2024-08-14
申请号：EP22878601.8
申请日：2022-10-06
发明人： SASAKI, Miho
IPC分类号： H01M50/197 , B65D65/40 , H01M10/04 , H01M50/105 , H01M50/121 , H01M50/129 , H01M50/184 , H01M50/193 , H01M50/198 , H01M50/342 , H01M50/375
CPC分类号： Y02E60/10 , B65D65/40 , H01M10/04 , H01M50/105 , H01M50/121 , H01M50/129 , H01M50/184 , H01M50/193 , H01M50/197 , H01M50/198 , H01M50/342 , H01M50/375
摘要： Provided is an adhesive film for use in a power storage device, wherein: the power storage device has a structure in which a power storage device element is accommodated in a package body formed of a power storage device exterior material; the power storage device exterior material is composed of a laminate including, in order from the outside, at least a base layer, a barrier layer, and thermally fusible resin layers; the power storage device element is accommodated in the package body by thermally fusing together the thermally fusible resin layers of the power storage device exterior material; the adhesive film is used so as to be interposed between the thermally fusible resin layers, at a position where the thermally fusible resin layers are thermally fused; the adhesive film includes at least a resin layer A and an adhesive layer P; the melting peak temperature of the resin layer A is at least 135°C; and the melting peak temperature of the adhesive layer P is no more than 100°C.
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