Invention Publication
- Patent Title: Compound Semiconductor Device and Manufacturing Method of the Same
- Patent Title (中): 复合半导体器件及其制造方法
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Application No.: EP13164120.1Application Date: 2006-03-16
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Publication No.: EP2677544A1Publication Date: 2013-12-25
- Inventor: Kikkawa, Toshihide
- Applicant: FUJITSU LIMITED
- Applicant Address: 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- Agency: Fenlon, Christine Lesley
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L29/20 ; H01L29/778 ; H01L29/267 ; H01L29/66 ; H01L29/205 ; H01L29/51
Abstract:
A compound semiconductor device comprising: a GaN based carrier transit layer formed over a semiconductor substrate; a GaN based carrier supply layer formed on said carrier transit layer; a GaN based protective layer formed on said carrier supply layer; a source electrode, a drain electrode and a gate electrode formed on said protective layer; an AlN layer formed on said protective layer, and positioned between said gate electrode and said source electrode, and between said gate electrode and said drain electrode; and an insulator layer formed on said AlN layer; wherein a GaN based compound semiconductor layer is formed between said AlN layer and said insulator layer, and a silicon layer is formed between said AlN layer and said compound semiconductor layer.
Public/Granted literature
- EP2677544B1 Compound Semiconductor Device and Manufacturing Method of the Same Public/Granted day:2015-04-22
Information query
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