Abstract:
The invention includes providing gallium nitride material devices having backside vias and methods to form the devices. The devices include a gallium nitride material (14) formed over a substrate (12), such as silicon. The device also may include one or more non-conducting layers (15) between the substrate (12) and the gallium nitride material (14) which can aid in the deposition of the gallium nitride material. A via (24) is provided which extends from the backside (22) of the device through the non-conducting layer(s) (15) to enable electrical conduction between an electrical contact (20) deposited within the via (21) and, for example, an electrical contact (16) on the topside of the device. Thus, devices of the invention may be vertically conducting. In other cases, the vias may be free of electrical contacts, for example, to enhance light extraction. Exemplary devices include laser diodes (LDs), light emitting diodes (LEDs), power rectifier diodes, FETs (e.g., HFETs), Gunn-effect diodes, and varactor diodes, amongst others.
Abstract:
Bidirectional switches are described. The bidirectional switches include first and a second III-N based high electron mobility transistor. In some embodiments, the source of the first transistor is in electrical contact with a source of the second transistor. In some embodiments, the drain of the first transistor is in electrical contact with a drain of the second transistor. In some embodiments, the two transistors share a drift region and the switch is free of a drain contact between the two transistors. Matrix converters can be formed from the bidirectional switches.
Abstract:
A substrate with a thin film, comprising: a substrate composed of silicon carbide and having a main surface having a diameter of 2 inches or greater; and a thin film composed of silicon carbide and formed on one said main surface, and a value for bow at said main surface being not smaller than -40 µm and not greater than 0 µm, and a value for warp at said main surface being not smaller than 0 µm and not greater than 40 µm.
Abstract:
A compound semiconductor device comprising: a GaN based carrier transit layer formed over a semiconductor substrate; a GaN based carrier supply layer formed on said carrier transit layer; a GaN based protective layer formed on said carrier supply layer; a source electrode, a drain electrode and a gate electrode formed on said protective layer; an AlN layer formed on said protective layer, and positioned between said gate electrode and said source electrode, and between said gate electrode and said drain electrode; and an insulator layer formed on said AlN layer; wherein a GaN based compound semiconductor layer is formed between said AlN layer and said insulator layer, and a silicon layer is formed between said AlN layer and said compound semiconductor layer.
Abstract:
Target is to provide an organic compound material having a bipolar character. A quinoxaline derivative represented by a general formula (1) is provided. In the formula, R 1 - R 12 each independently represents a hydrogen atom, a halogen atom, a lower alkyl group, an alkoxy group, an acyl group, a nitro group, a cyano group, an amino group, a dialkylamino group, a diarylamino group, a vinyl group, an aryl group, or a heterocyclic residue group. R 9 and R 10 , R 10 and R 11 , and R 11 and R 12 are each independent or respectively mutually bonded to form an aromatic ring. Ar 1 - Ar 4 each independently represents an aryl group or a heterocyclic residue group. Ar 1 , Ar 2 , Ar 3 and Ar 4 are each independent or Ar 1 and Ar 2 , and Ar 3 and Ar 4 are respectively mutually bonded directly, or Ar 1 and Ar 3 , and Ar 3 and Ar 4 are bonded via oxygen (O), sulfur (S) or a carbonyl group.
Abstract:
A low-loss GaN-based semiconductor device can be easily realized by making use of the polarization junction, fundamentally easing the peak electric field generating in a region of a conductive channel, and along with making high voltage resistance, and suppressing the generation of current collapse at the practical level. The semiconductor device has the In z Ga 1-z N layer 11 (where 0 ≤ z x Ga 1-x N layer 12 (where 0 y Ga 1-y N layer 13 (where 0 ≤ y w Ga 1-w N layer 14 (where 0 ≤ w y Ga 1-y N layer 13 in the vicinity part of a hetero-interface between the Al x Ga 1-x N layer 12 and the In y Ga 1-y N layer 13, and the two-dimensional electron gas 16 is formed in the In z Ga 1-z N layer 16 in the vicinity part of a hetero-interface between the In z Ga 1-z N layer 11 and the Al x Ga 1-x N layer 12.
Abstract:
A leaving substituent-containing compound represented by General Formula (I), wherein the leaving substituent-containing compound can be converted to a compound represented by General Formula (Ia) and a compound represented by General Formula (II), by applying energy to the leaving substituent-containing compound, in General Formulas (I), (Ia) and (II), X and Y each represent a hydrogen atom or a leaving substituent, where one of X and Y is the leaving substituent and the other is the hydrogen atom; Q 2 to Q 5 each represent a hydrogen atom, a halogen atom or a monovalent organic group; Q 1 and Q 6 each represent a hydrogen atom or a monovalent organic group other than the leaving substituent; and among the monovalent organic groups represented by Q 1 to Q 6 , adjacent monovalent organic groups may be linked together to form a ring.