GALLIUM NITRIDE MATERIAL DEVICES AND METHODS INCLUDING BACKSIDE VIAS

    公开(公告)号:EP3561883A1

    公开(公告)日:2019-10-30

    申请号:EP19172826.0

    申请日:2002-02-22

    Abstract: The invention includes providing gallium nitride material devices having backside vias and methods to form the devices. The devices include a gallium nitride material (14) formed over a substrate (12), such as silicon. The device also may include one or more non-conducting layers (15) between the substrate (12) and the gallium nitride material (14) which can aid in the deposition of the gallium nitride material. A via (24) is provided which extends from the backside (22) of the device through the non-conducting layer(s) (15) to enable electrical conduction between an electrical contact (20) deposited within the via (21) and, for example, an electrical contact (16) on the topside of the device. Thus, devices of the invention may be vertically conducting. In other cases, the vias may be free of electrical contacts, for example, to enhance light extraction. Exemplary devices include laser diodes (LDs), light emitting diodes (LEDs), power rectifier diodes, FETs (e.g., HFETs), Gunn-effect diodes, and varactor diodes, amongst others.

    Iii-nitride bidirectional switches
    3.
    发明公开
    Iii-nitride bidirectional switches 审中-公开
    Bidirektionale III-Nitrid-Schalter

    公开(公告)号:EP2887402A2

    公开(公告)日:2015-06-24

    申请号:EP15153536.6

    申请日:2008-09-12

    Abstract: Bidirectional switches are described. The bidirectional switches include first and a second III-N based high electron mobility transistor. In some embodiments, the source of the first transistor is in electrical contact with a source of the second transistor. In some embodiments, the drain of the first transistor is in electrical contact with a drain of the second transistor. In some embodiments, the two transistors share a drift region and the switch is free of a drain contact between the two transistors. Matrix converters can be formed from the bidirectional switches.

    Abstract translation: 描述了双向开关。 双向开关包括第一和第二III-N基高电子迁移率晶体管。 在一些实施例中,第一晶体管的源极与第二晶体管的源极电接触。 在一些实施例中,第一晶体管的漏极与第二晶体管的漏极电接触。 在一些实施例中,两个晶体管共享漂移区,并且开关在两个晶体管之间没有漏极接触。 矩阵转换器可以由双向开关形成。

    Compound Semiconductor Device and Manufacturing Method of the Same
    5.
    发明公开
    Compound Semiconductor Device and Manufacturing Method of the Same 有权
    复合半导体器件及其制造方法

    公开(公告)号:EP2677544A1

    公开(公告)日:2013-12-25

    申请号:EP13164120.1

    申请日:2006-03-16

    Abstract: A compound semiconductor device comprising: a GaN based carrier transit layer formed over a semiconductor substrate; a GaN based carrier supply layer formed on said carrier transit layer; a GaN based protective layer formed on said carrier supply layer; a source electrode, a drain electrode and a gate electrode formed on said protective layer; an AlN layer formed on said protective layer, and positioned between said gate electrode and said source electrode, and between said gate electrode and said drain electrode; and an insulator layer formed on said AlN layer; wherein a GaN based compound semiconductor layer is formed between said AlN layer and said insulator layer, and a silicon layer is formed between said AlN layer and said compound semiconductor layer.

    Abstract translation: 一种化合物半导体器件,包括:在半导体衬底上形成的基于GaN的载流子传输层; 在所述载流子传输层上形成的基于GaN的载流子供应层; 在所述载流子供应层上形成的GaN基保护层; 形成在所述保护层上的源电极,漏电极和栅电极; 形成在所述保护层上并位于所述栅电极和所述源电极之间以及所述栅电极和所述漏电极之间的AlN层; 以及在所述AlN层上形成的绝缘体层; 其中在所述AlN层和所述绝缘层之间形成GaN基化合物半导体层,并且在所述AlN层和所述化合物半导体层之间形成硅层。

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