发明公开
EP2856503A1 METAL FINGER CAPACITORS WITH HYBRID METAL FINGER ORIENTATIONS IN STACK WITH UNIDIRECTIONAL METAL LAYERS
审中-公开
金属指具有混合金属指准则电容器一堆单向金属层
- 专利标题： METAL FINGER CAPACITORS WITH HYBRID METAL FINGER ORIENTATIONS IN STACK WITH UNIDIRECTIONAL METAL LAYERS
- 专利标题（中）： 金属指具有混合金属指准则电容器一堆单向金属层
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申请号： EP13729561.4申请日： 2013-05-31
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公开(公告)号： EP2856503A1公开(公告)日： 2015-04-08
- 发明人: ZHU, John J. , CHIDAMBARAM, Pr , GE, Lixin , YANG, Bin , CHOI, Jihong
- 申请人： Qualcomm Incorporated
- 申请人地址： International IP Administration 5775 Morehouse Drive San Diego, CA 92121 US
- 专利权人： Qualcomm Incorporated
- 当前专利权人： Qualcomm Incorporated
- 当前专利权人地址： International IP Administration 5775 Morehouse Drive San Diego, CA 92121 US
- 代理机构： Dunlop, Hugh Christopher
- 优先权： US201261654194P 20120601; US201213721089 20121220
- 国际公布： WO2013181590 20131205
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L49/02 ; H01L27/02
摘要：
A semiconductor die (104; 118) having a plurality of metal layers (106; 108; 110; 112; 114; 116; 120; 122; 124; 126; 128; 130), including a set of metal layers having a preferred direction for minimum feature size (112; 114; 116; 126; 128; 130). The set of metal layers are such that adjacent metal layers have preferred directions orthogonal to one another. Finger capacitors (204; 304) formed in the set of metal layers are such that a finger capacitor formed in one metal layer has a finger direction parallel to the preferred direction of that metal layer. In bidirectional metal layers (106; 108; 110; 120; 122; 124), capacitor fingers may be in either direction.
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