Invention Grant
- Patent Title: Dielectric composition, dielectric film, and electronic component
- Patent Title (中): 电介质组合物和介电膜的电子部件
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Application No.: EP14192109.8Application Date: 2014-11-06
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Publication No.: EP2871649B1Publication Date: 2016-12-28
- Inventor: Takeda, Saori , Kaneko, Toshihiko , Yamashita, Yuki , Sezai, Yuji
- Applicant: TDK Corporation
- Applicant Address: 3-9-1, Shibaura, Minato-ku, Tokyo 108-0023 JP
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: 3-9-1, Shibaura, Minato-ku, Tokyo 108-0023 JP
- Agency: Epping - Hermann - Fischer
- Priority: JP2013231182 20131107; JP2014175731 20140829
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/12 ; H01L49/02 ; H01G4/08
Public/Granted literature
- EP2871649A1 Dielectric composition, dielectric film, and electronic component Public/Granted day:2015-05-13
Information query
