发明公开
- 专利标题： Die with a multilayer backside interface layer for solder bonding to a substrate and corresponding manufacturing method
- 专利标题（中）： 芯片与多层背面用于向基板钎焊连接和相应的生产方法
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申请号： EP13199587.0申请日： 2013-12-24
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公开(公告)号： EP2889903A1公开(公告)日： 2015-07-01
- 发明人: van Rijckevorsel, Johannes Wilhelmus , de Bruin, Emiel
- 申请人： NXP B.V.
- 申请人地址： High Tech Campus 60 5656 AG Eindhoven NL
- 专利权人： NXP B.V.
- 当前专利权人： NXP B.V.
- 当前专利权人地址： High Tech Campus 60 5656 AG Eindhoven NL
- 代理机构： Crawford, Andrew
- 主分类号： H01L23/482
- IPC分类号： H01L23/482 ; H01L21/60 ; H01L23/66
摘要：
A die (1) comprising a body (3) of semiconductor material, said body (3) configured to receive a solder layer (4) of e.g. an alloy of gold and tin for use in die bonding said die (1) to a substrate (2), wherein the die includes an interface layer (5) on a surface of the body (3) for receiving the solder layer (4), the interface layer (5) having a plurality of sub-layers (5a, 5b, 5c, 5d) of different metals. The interface layer (5) preferably comprises a first sub-layer (5a) of gold applied to the body (3), a second sub-layer (5b) of silver, a third sub-layer (5c) of nickel and a fourth sub-layer (5d) of gold adjoining the solder layer (4). The substrate (2) is preferably made of a copper substrate block (6) with a pad (7) of silver thereon, the substrate (6) and the pad (7) being plated with an outer layer (8) comprising sub-layers of nickel, palladium and gold.
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