发明公开
EP2990507A1 Composition, use thereof and method for electrodepositing gold containing layers
审中-公开
组合物，其用途和方法含金层的电沉积
- 专利标题： Composition, use thereof and method for electrodepositing gold containing layers
- 专利标题（中）： 组合物，其用途和方法含金层的电沉积
-
申请号： EP14182083.7申请日： 2014-08-25
-
公开(公告)号： EP2990507A1公开(公告)日： 2016-03-02
- 发明人: Breitfelder, Jana , Rüther, Robert, Dr. , Kurtz, Olaf, Dr.
- 申请人： Atotech Deutschland GmbH
- 申请人地址： Erasmusstraße 20 10553 Berlin DE
- 专利权人： Atotech Deutschland GmbH
- 当前专利权人： Atotech Deutschland GmbH
- 当前专利权人地址： Erasmusstraße 20 10553 Berlin DE
- 代理机构： Wonnemann, Jörg
- 主分类号： C25D3/48
- IPC分类号： C25D3/48 ; C25D21/18 ; C25D3/62
摘要：
The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto triazole as additive. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
信息查询
