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1.发明公开Plating bath compositions for electroless plating of metals and metal alloys 有权Plattierungsbadzusammensetzungen对金属和金属合金的电沉积
公开(公告)号：EP3034650A1
公开(公告)日：2016-06-22
申请号：EP14198380.9
申请日：2014-12-16
发明人： Brunner, Heiko, Dr. , Kohlmann, Lars , Karasahin, Sengül , Dammasch, Matthias, Dr. , Pape, Simon , Lucks, Sandra
摘要： The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.
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公开(公告)号：EP2825688B1
公开(公告)日：2016-05-18
申请号：EP13709442.1
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/1653 , C23C18/166 , C23C18/2073 , C23C18/2086 , C23C18/22 , C23C18/28 , C23C18/30 , C25D5/56
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3.发明授权ELECTROPLATING BATH AND METHOD FOR PRODUCING DARK CHROMIUM LAYERS 有权VERFAHREN ZER HERSTELLUNG VON DUNKLEN CHROMSCHICHTEN的GALVANISIERUNGSBAD
公开(公告)号：EP2705176B1
公开(公告)日：2016-04-13
申请号：EP12717725.1
申请日：2012-04-27
摘要： The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.
摘要翻译： 本发明涉及用于在工件上电沉积暗铬层的方法和电镀液。 三价铬电镀浴包含硫化合物，电沉积黑铬层的方法采用这些三价铬电镀浴。 暗铬沉积物和携带暗铬沉积物的工件适用于装饰目的。
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4.发明授权ALKALINE AQUEOUS ZINC-IRON ALLOY PLATING BATH AND METHOD USING THE SAME 有权ALKALISCHESWÄSSRIGESBADFÜREINE ZINK-EISENLEGIERUNGSPLATTIERUNG SOWIE VERFAHREN UNTER DESSEN VERWENDUNG
公开(公告)号：EP2675942B1
公开(公告)日：2016-04-06
申请号：EP12703030.2
申请日：2012-01-30
发明人： BEDRNIK, Lukas , HAAS, Frantisek , LANG, Nadine , VOGEL, Roland
CPC分类号： C25D3/565 , B32B15/013 , C25D5/48 , Y10T428/12792
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公开(公告)号：EP2358922B1
公开(公告)日：2016-01-27
申请号：EP09760833.5
申请日：2009-11-23
发明人： DINGWERTH, Björn , NOACK, Andreas
IPC分类号： C23C22/10
CPC分类号： C23C22/10 , C23C2222/10
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公开(公告)号：EP2784180B1
公开(公告)日：2015-12-30
申请号：EP13160785.5
申请日：2013-03-25
发明人： Kilian, Arnd, Dr. , Wegricht, Jens , Lautan, Donny
IPC分类号： C23C18/18 , H01L21/288 , H05K3/24
CPC分类号： C23C18/1831 , C23C18/1841 , C23C18/1844 , C23C18/36 , C23C18/44 , H01L21/288 , H01L21/76849 , H05K1/09 , H05K3/182 , H05K3/24
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7.发明授权
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8.发明公开Pre-treatment process for electroless plating 审中-公开Vorbehandlungsverfahren zur stromfreien Plattierung
公开(公告)号：EP2910666A1
公开(公告)日：2015-08-26
申请号：EP14156103.5
申请日：2014-02-21
CPC分类号： C23C18/32 , C23C18/1608 , C23C18/1841 , C23C18/42 , C23C18/50 , C23F1/02 , C23F1/30 , C23F1/44 , H05K3/187 , H05K3/244 , H05K3/26
摘要： The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.
摘要翻译： 本发明公开了一种将金属或金属合金化学镀在电子器件例如印刷电路板的铜特征上的方法，该印刷电路板抑制不期望的跳过电镀和外部电镀。 该方法包括以下步骤：i）提供这种基材，ii）用贵金属离子活化铜特征; iii）用含有酸，卤离子源和选自硫脲，硫脲衍生物和包含硫脲基团的聚合物的添加剂的含水预处理组合物除去过量的贵金属离子或其形成的沉淀物，以及iv）无电解 电镀金属或金属合金层。
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公开(公告)号：EP2886683A2
公开(公告)日：2015-06-24
申请号：EP14198132.4
申请日：2012-04-27
摘要： The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.
摘要翻译： 本发明涉及用于在工件上电沉积深铬层的方法和电镀槽。 三价铬电镀浴包含硫化合物，用于电沉积深铬层的方法使用这些三价铬电镀浴。 深色铬沉积物和携带深色铬沉积物的工件适用于装饰用途。
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公开(公告)号：EP2855732A2
公开(公告)日：2015-04-08
申请号：EP13728988.0
申请日：2013-05-31
发明人： BRUNNER, Heiko , PICALEK, Jan , BEJAN, Iulia , KRAUSE, Carsten , BERA, Holger , RÜCKBROD, Sven
IPC分类号： C23C18/34 , C23C18/50 , H01L21/288
CPC分类号： C23C18/34 , C23C18/1633 , C23C18/50 , H01L21/288 , H01L21/76849
摘要： The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
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