发明公开
- 专利标题： FLEXIBLE PACKAGING ARCHITECTURE
- 专利标题（中）： 灵活的VERPACKUNGSARCHITEKTUR
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申请号： EP14882778.5申请日： 2014-09-26
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公开(公告)号： EP3022765A1公开(公告)日： 2016-05-25
- 发明人: CHEAH, Bok Eng , KONG, Jackson Chung Peng , PERIAMAN, Shanggar , SKINNER, Michael , CHEW, Yen Hsiang , MAR, Kheng Tat , ABD RAZAK, Ridza Effendi , OOI, Kooi Chi
- 申请人： Intel Corporation
- 申请人地址： 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： 2200 Mission College Boulevard Santa Clara, CA 95054 US
- 代理机构： Rummler, Felix
- 国际公布： WO2016048347 20160331
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
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