公开(公告)号：EP3218928A1

公开(公告)日：2017-09-20

申请号：EP14889185.6

申请日：2014-11-12

申请人： Intel Corporation

发明人： TANG, Jiamiao ,  ZHAO, Junfeng ,  SKINNER, Michael P. ,  SHE, Yong ,  SIR, Jiun Hann ,  CHEAH, Bok Eng ,  PERIAMAN, Shanggar ,  OOI, Kooi Chi ,  CHEW, Yen Hsiang

IPC分类号： H01L23/28

CPC分类号： G06F1/163 ,  A41B1/00 ,  A41D1/06 ,  A41D1/08 ,  A41F9/002 ,  A43B3/001 ,  A43B3/0015 ,  A43B7/141 ,  A44C5/0015 ,  A44C15/005 ,  F03G5/06 ,  G06F1/189 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/0002 ,  H01L2924/181 ,  H02J1/14 ,  H05K1/189 ,  H05K2201/05 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate (102). The flexible substrate (102) may have a plurality of dies (104 -112) coupled therewith. The IC package may include a first encapsulation material (116-120), having a first rigidity, disposed on the flexible substrate (102) to at least partially encapsulate each die of the plurality dies (104 -112). The IC package may further include a second encapsulation material (122), having a second rigidity, disposed on the flexible substrate (102). In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例针对集成电路（IC）封装。 在实施例中，集成电路（IC）封装可以包括柔性衬底。 柔性衬底可以具有与其耦合的多个管芯。 IC封装可以包括具有第一刚性的第一封装材料，该第一封装材料设置在柔性衬底上以至少部分地封装多个管芯中的每个管芯。 IC封装可以进一步包括设置在柔性基板上的具有第二刚性的第二封装材料。 在实施例中，第二刚性和第一刚性彼此不同。 其他实施例可以被描述和/或要求保护。

公开(公告)号：EP3022765A1

公开(公告)日：2016-05-25

申请号：EP14882778.5

申请日：2014-09-26

申请人： Intel Corporation

发明人： CHEAH, Bok Eng ,  KONG, Jackson Chung Peng ,  PERIAMAN, Shanggar ,  SKINNER, Michael ,  CHEW, Yen Hsiang ,  MAR, Kheng Tat ,  ABD RAZAK, Ridza Effendi ,  OOI, Kooi Chi

IPC分类号： H01L23/12

CPC分类号： H01L23/5387 ,  H01L21/4846 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73259 ,  H01L2924/15311

摘要： A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.

摘要翻译： 描述了适用于弯曲包装形状的柔性包装结构。 在一个示例中，封装具有第一裸片，第一裸片上的第一模具化合物层，第一模具化合物层之上的布线层，布线层上的电耦合到布线层的第二裸片，以及第二模具化合物 在第二个模具上。

公开(公告)号：EP3371828A1

公开(公告)日：2018-09-12

申请号：EP15907962.3

申请日：2015-11-05

申请人： Intel Corporation

发明人： CHEAH, Bok Eng ,  KONG, Jackson, Chung Peng ,  OOI, Ping Ping ,  OOI, Kooi Chi ,  PERIAMAN, Shanggar

IPC分类号： H01L25/065 ,  H01L25/07 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/568 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1816 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed toward a stacked package assembly for embedded dies and associated techniques and configurations. In one embodiment, stacked package assembly may comprise a first die package and a second die package stacked one upon the other with plural interconnections between them; and a voltage reference plane embedded in at least one of the first and second die packages in proximity and generally parallel to the other of the first and second die packages.

公开(公告)号：EP3039505A1

公开(公告)日：2016-07-06

申请号：EP14889183.1

申请日：2014-11-12

申请人： Intel Corporation

发明人： MEYER, Thorsten ,  PLENKERS, Dirk ,  BARTH, Hans-Joachim ,  WAIDHAS, Bernd ,  CHEW, Yen Hsiang ,  OOI, Kooi Chi ,  LOO, Howe Yin

IPC分类号： G06F1/16

CPC分类号： G06F1/163 ,  B29C39/021 ,  B29C39/10 ,  B29C65/4825 ,  B29L2031/3481 ,  G02C5/143 ,  G02C11/10

摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

摘要翻译： 可穿戴电子设备，其组件以及相关系统和技术的实施例在此公开。 例如，可穿戴电子设备可以包括具有第一表面和第二表面的可穿戴支撑结构; 位于所述第一表面的第一电极，其中，当所述可佩戴的电子装置在使用者身体的一部分佩戴时，所述第一电极被布置成在所述使用者身体的所述部分中接触所述使用者的皮肤; 位于所述第二表面的第二电极，其中，当所述可佩戴的电子装置被使用者佩戴在所述使用者身体的所述部分上时，所述第二电极被布置为在所述用户身体的所述部分中不接触所述使用者的皮肤; 以及电阻开关，其具有分别耦合到所述第一和第二电极的第一和第二输入端子。 可以公开和/或要求保护其他实施例。

公开(公告)号：EP3627388A1

公开(公告)日：2020-03-25

申请号：EP19193451.2

申请日：2019-08-23

申请人： INTEL Corporation

发明人： CONDE, Naissa ,  BARON, Casey ,  QAWAMI, Shekoufeh ,  OOI, Kooi Chi ,  YU, Mengjie

IPC分类号： G06K9/00

摘要： Apparatuses and methods for evaluating the risk factors of a proposed vehicle maneuver using remote data are disclosed. In embodiments, a computer-assisted/autonomous driving vehicle communicates with one or more remote data sources to obtain remote sensor data, and process such remote sensor data to determine the risk of a proposed vehicle maneuver. A remote data source may be authenticated and validated, such as by correlation with other remote data sources and/or local sensor data. Correlation may include performing object recognition upon the remote data sources and local sensor data. Risk evaluation is performed on the validated data, and the results of the risk evaluation presented to a vehicle operator or to an autonomous vehicle navigation system.

公开(公告)号：EP3462478A1

公开(公告)日：2019-04-03

申请号：EP18191575.2

申请日：2018-08-29

申请人： INTEL Corporation

发明人： KONG, Jackson Chung Peng ,  CHEAH, Bok Eng ,  OOI, Kooi Chi ,  ONG, Paik Wen

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/64 ,  H01L25/065

摘要： Ring-in-ring stiffeners (112, 114, 116) on a semiconductor package substrate (110) includes a passive device (118, 120, 122, 124) that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.