发明公开
EP3026764A4 METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE MEMBER AND METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE BONDING PACKAGE
审中-公开
用于生产各向异性导电元件及其制造方法的各向异性导电BONDINGVERKAPSELUNG
- 专利标题： METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE MEMBER AND METHOD FOR FABRICATION OF ANISOTROPIC CONDUCTIVE BONDING PACKAGE
- 专利标题（中）： 用于生产各向异性导电元件及其制造方法的各向异性导电BONDINGVERKAPSELUNG
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申请号： EP14830337申请日： 2014-07-18
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公开(公告)号： EP3026764A4公开(公告)日： 2016-11-16
- 发明人: KOZAWA YUSUKE
- 申请人： FUJIFILM CORP
- 专利权人： FUJIFILM CORP
- 当前专利权人： FUJIFILM CORP
- 优先权： JP2013151603 2013-07-22
- 主分类号： H01R43/00
- IPC分类号： H01R43/00 ; C23C18/16 ; C25D1/00 ; C25D3/38 ; C25D5/50 ; C25D11/04 ; C25D11/10 ; C25D11/16 ; C25D11/18 ; C25D11/20 ; C25D11/24 ; H01B5/16 ; H01B13/00 ; H01R11/01
摘要：
Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.
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