公开(公告)号：EP3621088B1

公开(公告)日：2023-08-23

申请号：EP17936255.3

申请日：2017-12-27

发明人： NAKAJIMA, Masao ,  OHTO, Naomi

IPC分类号： H01B7/06 ,  H01B5/16 ,  H01B7/40 ,  H05K3/10 ,  D04B1/14 ,  G02B6/44 ,  H01B7/04 ,  H01B13/008 ,  H05K1/02 ,  D04B1/00 ,  D04B1/18 ,  B32B5/02 ,  A41D1/00 ,  A41D31/02 ,  A61B5/00 ,  A61D13/00 ,  B32B15/04 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20

公开(公告)号：EP3776601A1

公开(公告)日：2021-02-17

申请号：EP19785374.0

申请日：2019-04-15

申请人： Navitas Systems LLC

发明人： ZHANG, Pu ,  WIXOM, Michael

IPC分类号： H01B5/16 ,  H01B1/24 ,  H01B1/08 ,  H01B3/44 ,  C08J5/18 ,  C08L27/18 ,  C08K3/04

公开(公告)号：EP2592127B1

公开(公告)日：2020-07-22

申请号：EP11803479.2

申请日：2011-06-28

申请人： Dexerials Corporation

发明人： SAKAMOTO Jun ,  KONISHI Misao

IPC分类号： C09J201/00 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01B5/16 ,  H01R4/04 ,  H01R11/01 ,  C08K3/08

公开(公告)号：EP2607520B1

公开(公告)日：2019-10-30

申请号：EP11818207.0

申请日：2011-08-17

申请人： Mitsubishi Materials Electronic Chemicals Co., Ltd.

发明人： NAKABAYASHI, Akira ,  SASAKI, Shigeharu ,  YAMAMOTO, Kazutoshi ,  YAMAGUCHI, Maki

IPC分类号： C23C18/44 ,  C09J9/02 ,  C23C18/31 ,  H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01B13/00 ,  H01R11/01

公开(公告)号：EP3549885A1

公开(公告)日：2019-10-09

申请号：EP17876432.0

申请日：2017-11-30

申请人： Sun Fluoro System Co., Ltd.

发明人： YANO Shinichi ,  KAWAGUCHI Mitsuyoshi ,  KATSUBE Toshiyuki

IPC分类号： B65D90/04 ,  C08K3/04 ,  C08L27/12 ,  H01B1/04 ,  H01B5/16

摘要： The purpose of the present invention is to provide: a member which contacts liquid, gas, or powder insulating material when the insulating material is caused to flow and which is less susceptible to dielectric breakdown; a distribution mechanism, tank, and device using a sheet for lining the member or the inside of a pipe or a tank containing the member; a storage tank wherein a portion of the surface of a liquid-contact portion thereof comprises the member; a storage method for storing organic solvent, ultrapure water, and hydrogen peroxide water, particularly organic solvent, ultrapure water, and hydrogen peroxide water used in semiconductor product manufacture, using the storage tanks; and a method for manufacturing a semiconductor product using the organic solvent stored in the storage tank. A resin composition containing a matrix resin and an electro-conductive material dispersed in the matrix resin is used for the member which contacts liquid, gas, or powder insulating material when the insulating material is caused to flow.

公开(公告)号：EP2921040B1

公开(公告)日：2019-01-09

申请号：EP13795967.2

申请日：2013-11-14

申请人： TE Connectivity Corporation

发明人： BLAZIC, Ernest Steven

IPC分类号： H01B5/16 ,  H05K5/00

公开(公告)号：EP3232445A4

公开(公告)日：2018-05-02

申请号：EP15866404

申请日：2015-12-08

申请人： DAINIPPON INK & CHEMICALS

发明人： KAWAMURA KAORI ,  MORIWAKI MASAYUKI ,  SANO YOSHIYUKI

IPC分类号： H01B1/22 ,  B22F1/00 ,  B22F9/00 ,  B22F9/20 ,  C08K3/08 ,  C08K3/24 ,  C08K5/16 ,  C08L79/02 ,  C09D5/24 ,  C09D163/00 ,  C09D171/02 ,  C09D179/02 ,  H01B5/16

CPC分类号： C09D5/24 ,  B05D1/005 ,  B05D3/0254 ,  B22F1/00 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/00 ,  B22F9/20 ,  B22F2001/0066 ,  B22F2301/255 ,  B82Y30/00 ,  C08G73/0206 ,  C08K3/08 ,  C08K3/24 ,  C08K5/16 ,  C08L79/02 ,  C09D5/031 ,  C09D7/40 ,  C09D7/61 ,  C09D11/52 ,  C09D163/00 ,  C09D171/02 ,  C09D179/02 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H05K1/097

摘要： A problem is to provide a silver paste which can produce, without variation in resistivity value, a conductive silver coating film exhibiting resistivity substantially equivalent to the resistance value of bulk silver in low-temperature sintering. The problem is solved by providing a silver paste including a silver nanoparticle aqueous dispersion prepared by using a compound having a polyethyleneimine skeleton as a protective agent, a compound having a functional group reactable with nitrogen atoms in the polyethyleneimine, and at least one compound selected from the group consisting of a compound having an amine functional group and a compound having an amide functional group.

公开(公告)号：EP3118934A1

公开(公告)日：2017-01-18

申请号：EP15761023.9

申请日：2015-02-10

申请人： Dexerials Corporation

发明人： YAMADA, Yasunobu ,  SEKIGUCHI, Morio ,  KUMAKURA, Susumu

IPC分类号： H01R11/01 ,  C08J5/18 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J167/00 ,  C09J201/00 ,  H01B1/20 ,  H01B5/16 ,  H01R43/00

CPC分类号： C09J7/00 ,  C08K2201/001 ,  C08L75/04 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J167/00 ,  C09J175/04 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2467/00 ,  C09J2475/00 ,  H01B1/124 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2924/01047 ,  H01R4/04

摘要： An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10°C to 250°C and a heating speed is 10°C/min, and wherein T2 is 30°C or higher, and T4-T2 is greater than 0°C but 80°C or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

摘要翻译： 一种用于各向异性导电连接第一电子部件的端子和第二电子部件的端子的各向异性导电膜，所述各向异性导电膜包括：含有粘合剂层形成组分和导电颗粒的含导电颗粒的层，其中 导电粒子层在差示扫描量热法中具有两个吸热峰，其中在测量温度范围为10℃至250℃，加热速度为10℃/ min的条件下测量吸热峰值温度，其中T2 为30℃以上，T4-T2大于0℃但为80℃以下，其中T2为存在于较低温度侧的吸热峰的温度，T4为存在的吸热峰的温度 在较高的温度侧。

公开(公告)号：EP3026764A4

公开(公告)日：2016-11-16

申请号：EP14830337

申请日：2014-07-18

申请人： FUJIFILM CORP

发明人： KOZAWA YUSUKE

IPC分类号： H01R43/00 ,  C23C18/16 ,  C25D1/00 ,  C25D3/38 ,  C25D5/50 ,  C25D11/04 ,  C25D11/10 ,  C25D11/16 ,  C25D11/18 ,  C25D11/20 ,  C25D11/24 ,  H01B5/16 ,  H01B13/00 ,  H01R11/01

CPC分类号： C25D11/24 ,  C23C18/1603 ,  C23C18/1653 ,  C25D1/006 ,  C25D3/38 ,  C25D5/50 ,  C25D11/045 ,  C25D11/10 ,  C25D11/16 ,  C25D11/18 ,  C25D11/20

摘要： Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.

公开(公告)号：EP2963655A1

公开(公告)日：2016-01-06

申请号：EP14756789.5

申请日：2014-02-28

申请人： Sekisui Chemical Co., Ltd.

发明人： ISHIDA, Hiroya ,  MATSUSHITA, Kiyoto

IPC分类号： H01B5/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01

CPC分类号： H01B1/22 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/12 ,  H01B1/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29469 ,  H01L2224/29481 ,  H01L2224/29487 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/834 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2924/3512 ,  H01L2924/3651 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2203/0425 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/05342 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01029

摘要： The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5 % by weight relative to tin contained in the solder layer.

摘要翻译： 本发明的目的在于提供一种导电性微粒，即使在通过滴下等施加冲击时，由于电极和导电性微粒之间的连接界面的断裂，也不太可能导致断开，并且即使在重复加热之后也不易疲劳， 冷却，各向异性导电材料和导电连接结构，均使用导电性微粒制造。 本发明涉及在由树脂或金属制成的核心颗粒的表面上至少包含导电金属层，阻挡层，铜层和含锡的焊料层按顺序层叠的导电性微粒， 铜层和焊料层直接相互接触，铜层与含有铜的焊料层直接相对于焊料层中所含的锡的重量比为0.5〜5重量％。