发明公开
EP3034650A1 Plating bath compositions for electroless plating of metals and metal alloys
有权
Plattierungsbadzusammensetzungen对金属和金属合金的电沉积
- 专利标题： Plating bath compositions for electroless plating of metals and metal alloys
- 专利标题（中）： Plattierungsbadzusammensetzungen对金属和金属合金的电沉积
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申请号： EP14198380.9申请日： 2014-12-16
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公开(公告)号： EP3034650A1公开(公告)日： 2016-06-22
- 发明人: Brunner, Heiko, Dr. , Kohlmann, Lars , Karasahin, Sengül , Dammasch, Matthias, Dr. , Pape, Simon , Lucks, Sandra
- 申请人： Atotech Deutschland GmbH
- 申请人地址： Erasmusstraße 20 10553 Berlin DE
- 专利权人： Atotech Deutschland GmbH
- 当前专利权人： Atotech Deutschland GmbH
- 当前专利权人地址： Erasmusstraße 20 10553 Berlin DE
- 代理机构： Wonnemann, Jörg
- 主分类号： C23C18/34
- IPC分类号： C23C18/34 ; C23C18/36 ; C23C18/40 ; C23C18/48 ; C23C18/50
摘要：
The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.
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