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1.发明公开Plating bath compositions for electroless plating of metals and metal alloys 有权Plattierungsbadzusammensetzungen对金属和金属合金的电沉积
公开(公告)号：EP3034650A1
公开(公告)日：2016-06-22
申请号：EP14198380.9
申请日：2014-12-16
发明人： Brunner, Heiko, Dr. , Kohlmann, Lars , Karasahin, Sengül , Dammasch, Matthias, Dr. , Pape, Simon , Lucks, Sandra
摘要： The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.
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2.发明授权
公开(公告)号：EP3034650B1
公开(公告)日：2017-06-21
申请号：EP14198380.9
申请日：2014-12-16
发明人： Brunner, Heiko, Dr. , Kohlmann, Lars , Karasahin, Sengül , Dammasch, Matthias, Dr. , Pape, Simon , Lucks, Sandra
摘要： The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.
摘要翻译： 本发明涉及可用于无电金属和金属合金镀浴中的添加剂以及所述镀浴的使用方法。 这种添加剂降低了电镀速率并增加了无电镀浴的稳定性，因此，这种无电镀浴特别适用于将所述金属或金属合金沉积到凹槽结构中，例如印刷电路板，IC衬底和半导体中的沟槽和通孔 基板。 化学镀浴对显示应用的金属化更有用。
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