发明公开
- 专利标题： ADDITIVE FOR A SILICONE ENCAPSULANT
- 专利标题（中）： 硅酮封装剂的添加剂
-
申请号： EP14766324.9申请日： 2014-09-02
-
公开(公告)号： EP3041896A1公开(公告)日： 2016-07-13
- 发明人: KLEYER, Donald L. , SCHMIDT, Randall G. , TOMASIK, Adam C. , XU, Shengqing
- 申请人： Dow Corning Corporation
- 申请人地址： 2200 West Salzburg Road Midland, Michigan 48686-0994 US
- 专利权人： Dow Corning Corporation
- 当前专利权人： Dow Corning Corporation
- 当前专利权人地址： 2200 West Salzburg Road Midland, Michigan 48686-0994 US
- 代理机构： Fyfe, Fiona Allison Watson
- 优先权： US201361873081P 20130903
- 国际公布： WO2015034814 20150312
- 主分类号： C08K5/5419
- IPC分类号： C08K5/5419 ; C08K9/10
摘要：
An additive for a silicone encapsulant has the structure: Formula (I) wherein R
1 and R
2 are each -O-Si(R
4 )(R
5 )(R
6 ) and each of R
4 , R
5 , and R
6 is independently chosen from C
1 -C
10 hydrocarbyl groups, C
1 -C
10 alkyl groups, C
2 -C
10 alkenyl groups, and C
6 -C
10 aryl groups, and wherein R
3 is independently chosen from C
1 -C
10 hydrocarbyl groups, C
1 -C
10 alkyl groups, C
2 -C
10 alkenyl groups, and C
6 -C
10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
1 and R
2 are each -O-Si(R
4 )(R
5 )(R
6 ) and each of R
4 , R
5 , and R
6 is independently chosen from C
1 -C
10 hydrocarbyl groups, C
1 -C
10 alkyl groups, C
2 -C
10 alkenyl groups, and C
6 -C
10 aryl groups, and wherein R
3 is independently chosen from C
1 -C
10 hydrocarbyl groups, C
1 -C
10 alkyl groups, C
2 -C
10 alkenyl groups, and C
6 -C
10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
公开/授权文献
- EP3041896B1 ADDITIVE FOR A SILICONE ENCAPSULANT 公开/授权日：2017-06-14
信息查询
