ADDITIVE FOR A SILICONE ENCAPSULANT
    1.
    发明授权
    ADDITIVE FOR A SILICONE ENCAPSULANT 有权
    硅酮封装剂的添加剂

    公开(公告)号:EP3041897B1

    公开(公告)日:2017-05-24

    申请号:EP14766326.4

    申请日:2014-09-02

    IPC分类号: C08K5/5419 C08K9/10

    摘要: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least one aryl group in a molecule and containing a metal atom selected from the group consisting of V, Ta, Nb and Ce, and (D) a hydrosilylation-reaction catalyst. The present invention can provide the curable silicone composition, which does not develop a crack by thermal aging and further can form a cured material that exhibits less yellowing. Abstract (as published by WIPO) The present invention pertains to a curable silicone composition comprising at least: (A) an organo-polysiloxane having, per molecule thereof, two or more alkenyl groups and one or more aryl groups; (B) an organo-polysiloxane having, per molecule thereof, two or more silicon-bonded hydrogen atoms; (C) an organo-polysiloxane having, per molecule thereof, one or more aryl groups, and a metal atom selected from a group consisting of V, Ta, Nb and Ce; and (D) a hydrosilation reaction catalyst. The present invention is capable of providing a curable silicone composition capable of forming a cured product which exhibits minimal yellowing, without producing cracks caused by thermal aging.

    摘要翻译: 本发明涉及一种可固化的有机硅组合物,其包含:(A)分子中具有至少两个烯基和至少一个芳基的有机聚硅氧烷,(B)分子中具有至少两个与硅原子键合的氢原子的有机聚硅氧烷 (C)在分子中具有至少一个芳基且含有选自V,Ta,Nb和Ce的金属原子的有机聚硅氧烷,和(D)氢化硅烷化反应催化剂。 本发明可以提供这样的可固化有机硅组合物,其不会由于热老化而产生裂纹并且还可以形成显示出较少黄变的固化材料。 摘要(由WIPO公开)本发明涉及可固化有机硅组合物,其至少包含:(A)每分子具有两个或更多个烯基和一个或更多个芳基的有机聚硅氧烷; (B)每分子具有两个或更多个与硅键合的氢原子的有机聚硅氧烷; (C)每个分子具有一个或多个芳基和选自V,Ta,Nb和Ce的金属原子的有机聚硅氧烷; 和(D)硅氢化反应催化剂。 本发明能够提供一种可固化的硅氧烷组合物,其能够形成显示最小发黄的固化产物,而不会产生由热老化引起的裂纹。

    ADDITIVE FOR A SILICONE ENCAPSULANT
    2.
    发明公开
    ADDITIVE FOR A SILICONE ENCAPSULANT 有权
    硅酮封装剂的添加剂

    公开(公告)号:EP3041896A1

    公开(公告)日:2016-07-13

    申请号:EP14766324.9

    申请日:2014-09-02

    IPC分类号: C08K5/5419 C08K9/10

    摘要: An additive for a silicone encapsulant has the structure: Formula (I) wherein R
    1 and R
    2 are each -O-Si(R
    4 )(R
    5 )(R
    6 ) and each of R
    4 , R
    5 , and R
    6 is independently chosen from C
    1 -C
    10 hydrocarbyl groups, C
    1 -C
    10 alkyl groups, C
    2 -C
    10 alkenyl groups, and C
    6 -C
    10 aryl groups, and wherein R
    3 is independently chosen from C
    1 -C
    10 hydrocarbyl groups, C
    1 -C
    10 alkyl groups, C
    2 -C
    10 alkenyl groups, and C
    6 -C
    10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.

    摘要翻译: 用于硅酮密封剂的添加剂具有以下结构:其中R 1和R 2各自为-O-Si(R 4)(R 5)(R 6)且R 4,R 5和R 6中的每一个 独立地选自C 1 -C 10烃基,C 1 -C 10烷基,C 2 -C 10烯基和C 6 -C 10芳基,并且其中R 3独立地选自C 1 -C 10 烃基,C 1 -C 10烷基,C 2 -C 10烯基和C 6 -C 10芳基。 使用包括使铁金属或铁(III)化合物与羟基官能有机硅氧烷反应的步骤的方法形成添加剂。 密封剂包括添加剂和聚有机硅氧烷。 密封剂可用于形成包括电子部件和设置在电子部件上的密封剂的装置。 该设备使用包括将密封剂设置在电子设备上的步骤的方法形成。

    ADDITIVE FOR A SILICONE ENCAPSULANT
    4.
    发明公开
    ADDITIVE FOR A SILICONE ENCAPSULANT 有权
    硅酮封装剂的添加剂

    公开(公告)号:EP3041897A1

    公开(公告)日:2016-07-13

    申请号:EP14766326.4

    申请日:2014-09-02

    IPC分类号: C08K5/5419 C08K9/10

    摘要: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least one aryl group in a molecule and containing a metal atom selected from the group consisting of V, Ta, Nb and Ce, and (D) a hydrosilylation-reaction catalyst. The present invention can provide the curable silicone composition, which does not develop a crack by thermal aging and further can form a cured material that exhibits less yellowing. Abstract (as published by WIPO) The present invention pertains to a curable silicone composition comprising at least: (A) an organo-polysiloxane having, per molecule thereof, two or more alkenyl groups and one or more aryl groups; (B) an organo-polysiloxane having, per molecule thereof, two or more silicon-bonded hydrogen atoms; (C) an organo-polysiloxane having, per molecule thereof, one or more aryl groups, and a metal atom selected from a group consisting of V, Ta, Nb and Ce; and (D) a hydrosilation reaction catalyst. The present invention is capable of providing a curable silicone composition capable of forming a cured product which exhibits minimal yellowing, without producing cracks caused by thermal aging.

    摘要翻译: (I)R 1 Ce(OSi-R 2)II a R 3其中a是3或4,其中R 1和R 2各自是-O-Si(R 4)( R 5)(R 6),并且R 4,R 5和R 6中的每一个独立地选自C 1 -C 10烃基,C 1 -C 10烷基,C 2 -C 10烯基和C 6 -C 10芳基,并且其中R 3独立地选自C 1 -C 10烃基,C 1 -C 10烷基,C 2 -C 10烯基和C 6 -C 10芳基。 更具体地说,铈是铈(III)或(IV)。 使用包括使铈金属或铈(III)或(IV)化合物与羟基官能有机硅氧烷反应的步骤的方法形成添加剂。 密封剂包括添加剂和聚有机硅氧烷。 密封剂可用于形成包括光电子器件和设置在光电子器件上的密封剂的器件。 该装置使用包括将密封剂设置在光电子器件上的步骤的方法形成。