发明公开
EP3051580A4 UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAID UNDERFILL MATERIAL
审中-公开
UNTERFÜLLUNGSMATERIALUND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS MIT DIESEMUNTERFÜLLUNGSMATERIAL
- 专利标题： UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAID UNDERFILL MATERIAL
- 专利标题（中）： UNTERFÜLLUNGSMATERIALUND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS MIT DIESEMUNTERFÜLLUNGSMATERIAL
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申请号： EP14848144申请日： 2014-09-10
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公开(公告)号： EP3051580A4公开(公告)日： 2017-07-05
- 发明人: MORIYAMA HIRONOBU
- 申请人： DEXERIALS CORP
- 专利权人： DEXERIALS CORP
- 当前专利权人： DEXERIALS CORP
- 优先权： JP2013201613 2013-09-27
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; C08G59/18 ; C08G59/24 ; C08G59/42 ; C08G59/68 ; C08L63/00 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/29
摘要：
An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240°C calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.
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