发明公开
EP3198641A1 SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME
审中-公开
半导体封装互连及其制造方法
- 专利标题： SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME
- 专利标题（中）： 半导体封装互连及其制造方法
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申请号： EP15775578.6申请日： 2015-09-25
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公开(公告)号： EP3198641A1公开(公告)日： 2017-08-02
- 发明人: KIM, Dong Wook , LEE, Jae Sik , WE, Hong Bok , SONG, Young Kyu , KIM, Chin-Kwan , HWANG, Kyu-Pyung , GU, Shiqun
- 申请人： Qualcomm Incorporated
- 申请人地址： International IP Administration 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 专利权人： Qualcomm Incorporated
- 当前专利权人： Qualcomm Incorporated
- 当前专利权人地址： International IP Administration 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 代理机构： Howe, Steven
- 优先权： US201414498076 20140926
- 国际公布： WO2016049454 20160331
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/60
摘要：
A semiconductor package according to some examples of the disclosure may include a base (110) with a first redistribution layer (150) on one side, first (120) and second (130) side-by-side die attached to the base on an opposite side from the first redistribution layer, an interposer (140) attached to active sides of the first and second die to provide an interconnection between the first and second die, a plurality of die vias (180,181) extending from the first and second die to a second redistribution layer (170) on a surface of the package opposite the first redistribution layer, and a plurality of package vias (182) extending through the package between the first and second redistribution layers.
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