发明公开
EP3298625A1 SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
审中-公开
用于嵌入具有互连结构的3D组件的系统，装置和方法
- 专利标题： SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
- 专利标题（中）： 用于嵌入具有互连结构的3D组件的系统，装置和方法
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申请号： EP16728156.7申请日： 2016-05-19
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公开(公告)号： EP3298625A1公开(公告)日： 2018-03-28
- 发明人: RAE, David Fraser , KESER, Lizabeth Ann , ALVARADO, Reynante Tamunan
- 申请人： Qualcomm Incorporated
- 申请人地址： 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 专利权人： Qualcomm Incorporated
- 当前专利权人： Qualcomm Incorporated
- 当前专利权人地址： 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 代理机构： Howe, Steven
- 优先权： US201562165820P 20150522; US201514861484 20150922
- 国际公布： WO2016191193 20161201
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L25/16 ; H01L23/538 ; H01L25/10 ; H01L21/56
摘要：
A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.
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