- 专利标题: FLEXIBLE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
-
申请号: EP17765757.4申请日: 2017-03-09
-
公开(公告)号: EP3367438A1公开(公告)日: 2018-08-29
- 发明人: SHAN, Qi , HU, Kun , LIN, Li , CAI, Shixing , LIU, Shengfang
- 申请人: Kunshan New Flat Panel Display Technology Center Co., Ltd. , Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- 申请人地址: No. 320 Fu Chun River Road Photoelectric Industrial Park Development Zone Kunshan Jiangsu 215300 CN
- 专利权人: Kunshan New Flat Panel Display Technology Center Co., Ltd.,Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- 当前专利权人: Kunshan New Flat Panel Display Technology Center Co., Ltd.,Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- 当前专利权人地址: No. 320 Fu Chun River Road Photoelectric Industrial Park Development Zone Kunshan Jiangsu 215300 CN
- 代理机构: Neusser, Sebastian
- 优先权: CN201610150011 20160316
- 国际公布: WO2017157215 20170921
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; G09F9/30
摘要:
Provided are a flexible electronic device and a manufacturing method thereof. The flexible electronic device (200) comprises a flexible substrate (210) and a device layer formed on the flexible substrate (210). The device layer comprises a semiconductor structure (220) and a wire structure (230) connected to the semiconductor structure, the wire structure (230) having an extension direction same to a channel direction of the semiconductor structure (220). The extension direction of the first wire structure (230) forms an included angle smaller than 90° with respect to a stretching direction of the flexible substrate (210). In the flexible electronic device (200) and manufacturing method thereof of the present invention, the channel direction of the semiconductor structure (220) and the extension direction of the first wire structure (230) are adjusted, such that the semiconductor structure (220) and the first wire structure (230) are least affected by a stress, thus ensuring electrical property and flexibility of the flexible electronic device (200).
公开/授权文献
- EP3367438B1 FLEXIBLE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR 公开/授权日:2024-05-22
信息查询
IPC分类: