发明公开
- 专利标题: ATE TESTING SYSTEM AND METHOD FOR MILLIMETRE WAVE PACKAGED INTEGRATED CIRCUITS
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申请号: EP17159572.1申请日: 2017-03-07
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公开(公告)号: EP3373017A1公开(公告)日: 2018-09-12
- 发明人: Zanati, Abdellatif , Mahnke, Holger
- 申请人: NXP B.V.
- 申请人地址: High Tech Campus Building 60 5656 AG Eindhoven NL
- 专利权人: NXP B.V.
- 当前专利权人: NXP B.V.
- 当前专利权人地址: High Tech Campus Building 60 5656 AG Eindhoven NL
- 代理机构: Terblanche, Candice Jane
- 主分类号: G01R1/04
- IPC分类号: G01R1/04 ; G01R31/28
摘要:
An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).
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