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公开(公告)号：EP3483622B1
公开(公告)日：2020-08-05
申请号：EP17201071.2
申请日：2017-11-10
申请人： NXP B.V.
IPC分类号： G01S7/40 , G01S13/931
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公开(公告)号：EP4350878A1
公开(公告)日：2024-04-10
申请号：EP23194422.4
申请日：2023-08-31
申请人： NXP B.V.
摘要： An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.
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公开(公告)号：EP4007063A1
公开(公告)日：2022-06-01
申请号：EP21208216.8
申请日：2021-11-15
申请人： NXP B.V.
摘要： A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.
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公开(公告)号：EP3599482A1
公开(公告)日：2020-01-29
申请号：EP19185146.8
申请日：2019-07-09
申请人： NXP B.V.
摘要： A method includes generating a target map indicative of objects around the vehicle using sensor data from sensor circuitry of the vehicle, the sensor circuitry including at least one radar sensor; and determining, by processing circuitry, if the vehicle is being towed away. Determining if the vehicle is being towed away can include comparing the target map to a previously obtained target map, determining if the vehicle is moving based on the comparison, and in response to determining the vehicle is moving, outputting an alarm message indicative of the vehicle being towed away.
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公开(公告)号：EP3339897A1
公开(公告)日：2018-06-27
申请号：EP16205293.0
申请日：2016-12-20
申请人： NXP B.V.
CPC分类号： G01S7/003 , G01S7/40 , G01S7/497 , G01S13/86 , G01S13/878 , G01S13/931 , G01S17/936 , G01S2013/9353 , G01S2013/936 , G01S2013/9367
摘要： A method and apparatus are provided. The apparatus forms part of a first entity in a vehicle to vehicle network. The apparatus comprises a processor and receiver. The processor is configured to: receive first sensor data from a sensor system of the first entity; and determine at least one positional characteristic of a second entity in the vehicle to vehicle network. The receiver is configured to: selectively receive second sensor data from the second entity in dependence on the determined at least one positional characteristic; and provide the second sensor data to the processor. The processor is further configured to process the first sensor data and the second sensor data to at least partially determine an environment surrounding the first entity.
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公开(公告)号：EP4395064A1
公开(公告)日：2024-07-03
申请号：EP23215686.9
申请日：2023-12-11
申请人： NXP B.V.
CPC分类号： H01P5/103 , H01Q1/2283 , H01Q21/0037 , H01Q21/064
摘要： A circuit-board interposer includes contacts on a top surface and a bottom surface and includes a millimeter-wave coaxial transition structure formed using contacts on the top surface and vias extending into the interposer. A first via extends into the interposer to a first depth and is surrounded by additional vias that penetrate the interposer to a second depth smaller than the first depth. The interposer also includes a hollow conductive waveguide structure formed within the interposer that extends from the second depth to a third depth that has a first end and a second end. The first via extends into the waveguide at the first end and an aperture is present at the second end. The coaxial transition and the waveguide together are configured to couple millimeter-wave energy from a feed contact on the top surface of the interposer and direct it to the aperture.
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公开(公告)号：EP3339898A1
公开(公告)日：2018-06-27
申请号：EP16205551.1
申请日：2016-12-20
申请人： NXP B.V.
IPC分类号： G01S13/93
CPC分类号： B60W50/14 , B60W2050/143 , G01S7/003 , G01S7/40 , G01S7/497 , G01S13/86 , G01S13/878 , G01S13/931 , G01S17/936 , G01S2013/9353 , G01S2013/936 , G01S2013/9367 , G07B15/063 , G07C5/008 , G08G1/017 , G08G1/22 , H04B7/26
摘要： The apparatus forms part of a first entity in a vehicle to vehicle network. The apparatus comprises: a processor configured to receive first sensor data from a sensor system of the first entity; and a receiver. The receiver is configured to: receive second sensor data from a second entity in the vehicle to vehicle network over a communication network; and provide the second sensor data to the processor. The second sensor data comprises a first type of sensor data having a first bandwidth requirement. The processor is further configured to: determine an available bandwidth of the communication system; and when the first bandwidth requirement exceeds the communication bandwidth, select a second type of sensor data having a second bandwidth requirement, where the second bandwidth requirement is less than the first bandwidth requirement. The processor is further configured to process the first and second sensor data to at least partially determine an environment surrounding the first entity.
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公开(公告)号：EP4395067A1
公开(公告)日：2024-07-03
申请号：EP23215617.4
申请日：2023-12-11
申请人： NXP B.V.
IPC分类号： H01P5/107 , H01P3/12 , H01L23/538 , H01L23/66 , H01Q1/22
CPC分类号： H01P5/107 , H01P3/121 , H01L23/66 , H01L23/538 , H01Q1/2283
摘要： A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.
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9.发明公开
公开(公告)号：EP3611523A1
公开(公告)日：2020-02-19
申请号：EP19187535.0
申请日：2019-07-22
申请人： NXP B.V.
摘要： An example method includes stressing, under different circuit-stress test conditions, a plurality of different types of regional circuits susceptible to time dependent dielectric breakdown (TDDB), and in response, monitoring for levels of reliability failure associated with the plurality of different types of regional circuits. The method includes storing a set of stress-test data based on each of the levels of reliability failure, the set of stress-test data being stored within the integrated circuit to indicate reliability-threshold test data specific to the integrated circuit. Within the integrated circuit, an on-chip monitoring circuit indicates operational conditions of suspect reliability associated with dielectric breakdown of at least one of the plurality of different types of regional circuits. And, the method further includes, during operation of the integrated circuit, adjusting at least one of the different circuit-stress test conditions based on the indicated operational conditions of suspect reliability.
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公开(公告)号：EP3483622A1
公开(公告)日：2019-05-15
申请号：EP17201071.2
申请日：2017-11-10
申请人： NXP B.V.
摘要： A built-in self-test, BIST, radar unit (100) is described. The BIST radar unit (100) comprises: a frequency generation circuit (110) configured to generate a mmW transmit signal; a transmitter circuit comprising: at least one phase shifter (130, 132) configured apply at least one phase shift to the mmW transmit signal; and at least one phase inverter (140, 142) coupled to the at least one phase shifter (130, 132) and configured to invert a phase of the phase shifted mmW transmit signal. A receiver configured to receive and process a received version of the mmW transmit signal. The at least one phase inverter (140, 142) is configured to rotate the phase shifted mmW transmit signal to apply a secondary modulation to the mmW transmit signal; and the receiver is configured to receive and process a received version of the mmW transmit signal to determine an operational state of the BIST radar unit (100) based on a determined phase shift performance of the secondary modulation of the received version of the mmW transmit signal.
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