Invention Publication
- Patent Title: SHAPE MEASURING DEVICE
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Application No.: EP19195689.5Application Date: 2016-03-18
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Publication No.: EP3598058A1Publication Date: 2020-01-22
- Inventor: SEKIMOTO, Michihiro , TAKANASHI, Ryo , KIMURA, Hiroaki , MASUTA, Hikaru
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: 2968-2, Ishikawa-machi Hachioji-shi, Tokyo 192-8515 JP
- Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee Address: 2968-2, Ishikawa-machi Hachioji-shi, Tokyo 192-8515 JP
- Agency: Grünecker Patent- und Rechtsanwälte PartG mbB
- Priority: JP2015072599 20150331; JP2015072601 20150331
- Main IPC: G01B5/28
- IPC: G01B5/28 ; G01B5/20
Abstract:
The present invention has for object to efficiently use data acquired by roundness measurement for surface roughness measurement to reduce a measurement workload and improve measurement efficiency and the like. To achieve this object, measurement conditions in surface roughness measurement are set on the basis of data on a measuring object acquired by roundness measurement.
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