A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.