- 专利标题： EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISING SAME
-
申请号： EP18837842.6申请日： 2018-06-29
-
公开(公告)号： EP3660068A1公开(公告)日： 2020-06-03
- 发明人: PARK, Ji Seung , PARK, Chan Young , SHIM, Myoung Taek , JEON, Ki Young , LEE, Sang Sun
- 申请人： KCC Corporation
- 申请人地址： 344, Sapyeong-daero Seocho-gu Seoul 06608 KR
- 专利权人： KCC Corporation
- 当前专利权人： KCC Corporation
- 当前专利权人地址： 344, Sapyeong-daero Seocho-gu Seoul 06608 KR
- 代理机构： Patentwerk B.V.
- 优先权： KR20170095287 20170727
- 国际公布： WO2019022390 20190131
- 主分类号： C08G59/02
- IPC分类号： C08G59/02 ; C08K5/3445 ; C08K5/3492 ; C08G59/62 ; C08K5/5415 ; C08K5/14 ; C08K5/5313 ; C08K3/017 ; H01L23/29
摘要：
The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 µm, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.
信息查询
