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    AQUEOUS BINDER COMPOSITION AND METHOD FOR BINDING FIBROUS MATERIAL USING SAME
    3.
    发明公开
    AQUEOUS BINDER COMPOSITION AND METHOD FOR BINDING FIBROUS MATERIAL USING SAME 审中-公开
    维多利亚BINDEMITTELZUSAMMENSETZUNG UND VERFAHREN ZUR BINDUNG VON FASERMATERIAL DAMIT

    公开(公告)号：EP3127956A1

    公开(公告)日：2017-02-08

    申请号：EP15774413.7

    申请日：2015-03-31

    申请人： Kcc Corporation

    发明人： HONG, Seung Min ,  KIM, Yong Joo ,  JEONG, Young Gi

    IPC分类号： C08L5/00 ,  C08K5/16 ,  C08J5/00 ,  C09J105/00

    CPC分类号： C08K5/16 ,  C03C25/14 ,  C03C25/26 ,  C03C25/321 ,  C03C25/34 ,  C03C25/42

    摘要： The present invention relates to an aqueous binder composition and a method for binding fibrous materials by using the same, and more specifically, relates to an aqueous binder composition and a method for binding fibrous materials by using the same comprising one or more reducing sugars, one or more amino acids, and one or more ionic compounds including metal cation having oxidation number of 2 or higher. The present invention provides the same or better physical properties with lower price compared to traditional phenol formaldehyde resin (PFR), does not include or release toxic materials such as formaldehyde or phenol, and may decrease intoxication which is a vulnerable point of traditional PFR during manufacturing and remarkably enhances the mechanical properties such as water resistance, tensile strength and hardness of the manufactured product.

    摘要翻译： 本发明涉及水性粘合剂组合物和通过使用它的粘合纤维材料的方法，更具体地，涉及水性粘合剂组合物和通过使用包含一种或多种还原糖的纤维材料粘合纤维材料的方法，一种 或更多的氨基酸，以及一种或多种离子化合物，包括氧化数为2或更高的金属阳离子。 与传统的酚醛树脂（PFR）相比，本发明提供了与较低价格相同或更好的物理性质，不包括或释放有毒物质如甲醛或苯酚，并且可能减少中间产物，这在制造过程中是传统PFR的脆弱点 并且显着提高了制造产品的机械性能如耐水性，拉伸强度和硬度。

    TRANSPARENT SUBSTRATE WITH MULTILAYER ANTI-GLARE COATING
    4.
    发明公开
    TRANSPARENT SUBSTRATE WITH MULTILAYER ANTI-GLARE COATING 审中-公开
    透明质酸酯麻醉剂

    公开(公告)号：EP3124449A1

    公开(公告)日：2017-02-01

    申请号：EP16172412.5

    申请日：2016-06-01

    申请人： Hyundai Motor Company ,  KCC Corporation

    发明人： Kim, Sang Young ,  Bae, Kyoung Hwan ,  Kim, Jung Ju

    IPC分类号： C03C17/00 ,  C03C17/34 ,  G02B1/111

    CPC分类号： G02B1/115 ,  B60J3/007 ,  C03C17/34 ,  C03C17/3435 ,  C03C2217/00 ,  C03C2217/734 ,  G02B1/111

    摘要： A transparent substrate with a multilayer anti-glare coating includes a transparent substrate; a first coating layer formed on the transparent substrate and being formed of a first dielectric layer having a refractive index of n1; a second coating layer formed on the first coating layer and being formed of a metal oxide layer having a refractive index of n2; a third coating layer formed on the second coating layer and being formed of a second dielectric layer having a refractive index of n3; and a fourth coating layer formed on the third coating layer and being formed of a third dielectric layer having a refractive index of n4. The refractive indexes of the coating layers satisfy: n1 = n3 > n2 > n4.

    摘要翻译： 具有多层防眩涂层的透明基板包括透明基板; 形成在透明基板上并由折射率为n1的第一介质层形成的第一涂层; 形成在第一涂层上并由折射率为n2的金属氧化物层形成的第二涂层; 形成在第二涂层上并由折射率为n3的第二电介质层形成的第三涂层; 以及形成在第三涂层上并由折射率为n4的第三介电层形成的第四涂层。 涂层的折射率满足：n1 = n3> n2> n4。

    SLIDING WINDOW
    5.
    发明公开
    SLIDING WINDOW 有权
    SCHIEBEFENSTER

    公开(公告)号：EP2881530A1

    公开(公告)日：2015-06-10

    申请号：EP13826041.9

    申请日：2013-07-29

    申请人： KCC Corporation. Co. Ltd

    发明人： KIM, Sang Gon ,  SEO, Bong Gyun

    IPC分类号： E05D15/06 ,  E05D13/00 ,  E06B3/46

    CPC分类号： E06B7/26 ,  E05D15/0604 ,  E05D15/0669 ,  E05D15/10 ,  E05D15/56 ,  E05D2015/1039 ,  E05Y2800/12 ,  E06B3/4627

    摘要： A sliding window including: a window frame that is fixed in a wall and is provided with at least one rail therein; and a sash that is provided with a window wheel unit in contact with the rail of the window frame, and is provided with a diverting unit for diverting wheels of the window wheel unit. Due to the diverting unit, the window wheel unit can bring the sash into close contact with or can release the sash from the window frame, so the sliding window can remove a narrow gap from between the sash and the window frame. Accordingly, not only airtight, watertight, insulating, and soundproof performance can be improved, but also wind pressure resistance performance can be improved.

    摘要翻译： 一种滑动窗，包括：窗框，其固定在壁中并在其中设置有至少一个导轨; 以及窗框，其设置有与窗框的轨道接触的窗轮单元，并且设置有用于转向窗轮单元的车轮的转向单元。 由于转向单元，窗轮单元可以使窗框与窗框紧密接触或者可以从窗框释放窗扇，因此滑动窗可以从窗框和窗框之间移除窄的间隙。 因此，不仅可以提高气密性，防水性，隔音性和隔音性，而且可以提高耐风压性能。

    METAL-BONDED CERAMIC SUBSTRATE
    6.
    发明公开
    METAL-BONDED CERAMIC SUBSTRATE 审中-公开
    METALLGEBUNDENES KERAMIKSUBSTRAT

    公开(公告)号：EP2546870A2

    公开(公告)日：2013-01-16

    申请号：EP11753594.8

    申请日：2011-03-09

    申请人： KCC Corporation

    发明人： KIM, Kyong Hwan ,  HAN, Moon Su ,  PARK, Jun Hee

    IPC分类号： H01L23/15

    CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/86 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A metal-bonding ceramic substrate is provided. The ceramic substrate has a circuit pattern formed by bonding a metal layer on a surface thereof. A plurality of metal layers are disposed in rows and columns to form the circuit pattern. An additional metal layer is formed along an edge of at least one surface of the ceramic substrate to be disposed at the edge of the metal layer. In addition, the distance between the metal layers may be the same as that between the metal layer and the additional metal layer. Accordingly, dimension precision may be improved by reducing a variation of a circuit pattern in an etching process for forming a circuit, a bonding property of a semiconductor chip may be enhanced by reducing a temperature variation in thermal treatment of a lead ash layer for mounding the semiconductor chip, and bending of a substrate occurring due to a difference in the coefficient of thermal expansion between a metal and a ceramic may be reduced or artificially controlled.

    摘要翻译： 提供了金属结合陶瓷基板。 陶瓷基板具有通过在其表面上接合金属层而形成的电路图案。 多个金属层以行和列布置以形成电路图案。 沿着陶瓷基板的至少一个表面的边缘形成另外的金属层，以设置在金属层的边缘。 此外，金属层之间的距离可以与金属层和附加金属层之间的距离相同。 因此，通过减少用于形成电路的蚀刻工艺中的电路图案的变化，可以提高尺寸精度，通过降低用于堆焊的铅灰层的热处理的温度变化可以提高半导体芯片的接合性能 可以减少或人为地控制由于金属和陶瓷之间的热膨胀系数的差异而发生的基板的弯曲。