- 专利标题： POLISHING COMPOSITIONS AND METHODS OF USING SAME
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申请号： EP19172460.8申请日： 2019-05-03
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公开(公告)号： EP3670620A1公开(公告)日： 2020-06-24
- 发明人: BALLESTEROS, Carl , MISHRA, Abhudaya , TURNER, Eric
- 申请人： FUJIFILM Electronic Materials U.S.A, Inc.
- 申请人地址： 80 Circuit Drive North Kingstown RI 02852 US
- 专利权人： FUJIFILM Electronic Materials U.S.A, Inc.
- 当前专利权人： FUJIFILM Electronic Materials U.S.A, Inc.
- 当前专利权人地址： 80 Circuit Drive North Kingstown RI 02852 US
- 代理机构： Ammelburg, Jan Moritz
- 优先权： US201862781648P 20181219; US201916356685 20190318
- 主分类号： C09G1/02
- IPC分类号： C09G1/02
摘要：
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion and a hydrophilic portion; in which the hydrophobic portion includes a C 12 to C 40 hydrocarbon group and is separated by zero to ten alkylene oxide groups from the hydrophilic portion. The polishing composition has a pH of about 2 to about 6.5, and can have a ratio of a removal rate for a silicon oxide to a removal rate for a silicon nitride of at least about 3:1 when polishing a patterned wafer comprising at least silicon nitride patterns overlayed with at least silicon oxide.
公开/授权文献
- EP3670620B1 POLISHING COMPOSITIONS AND METHODS OF USING SAME 公开/授权日：2023-10-11
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