- 专利标题： CHEMICAL MECHANICAL PLANARIZATION USING NANODIAMOND
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申请号： EP20167117.9申请日： 2010-03-12
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公开(公告)号： EP3708631A1公开(公告)日： 2020-09-16
- 发明人: WANG, Jun , LACONTO, Ronald , HAERLE, Andrew
- 申请人： Saint-Gobain Ceramics & Plastics Inc.
- 申请人地址： One New Bond Street Worcester, Massachusetts 01615-0138 US
- 专利权人： Saint-Gobain Ceramics & Plastics Inc.
- 当前专利权人： Saint-Gobain Ceramics & Plastics Inc.
- 当前专利权人地址： One New Bond Street Worcester, Massachusetts 01615-0138 US
- 代理机构： Zimmermann & Partner Patentanwälte mbB
- 优先权： US159962P 20090313
- 主分类号： C09K3/14
- IPC分类号： C09K3/14 ; B24B37/00 ; C09G1/02 ; H01L21/02 ; H01L29/16 ; C01B32/25
摘要：
A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 Å/min to achieve a Ra of not greater than about 5.0 Å. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt% water.
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