The application concerns a method and apparatus for transferring components (11,12,13) such as micro-LEDs. A first substrate (10) is provided with the components (11,12,13). A second substrate (20) is provided with an adhesive layer (20a) comprising a hot melt adhesive material (20m). The components (11,12,13) on the first substrate (10) are contacted with the adhesive layer (20a) on the second substrate (20) while the adhesive layer (20a) is melted. The adhesive layer (20a) is allowed to solidify to form an adhesive connection between the components (11,12,13) and the second substrate (20). The first and second substrates (10,20) are moved apart to transfer the components (11,12,13) from the first substrate (10) to the second substrate (20). At least a subset of the components (11) is transferred from the second substrate (20) to a third substrate (30) by radiating light (L) onto the adhesive layer (20a) to form a jet (21j) of melted adhesive carrying the components (11). The third substrate (30) may be provided with recesses (31) for receiving the transferred components (10). An electrically conductive material (50s) may be applied to the components (11) while the components (11) are disposed on the third substrate (30). The third substrate (30) may comprise a hot melt adhesive layer (31a) to hold the components (11) after transfer. The components (11) or a subset thereof may be transferred from the third substrate (30) to the fourth substrate (40), e.g. using selective illumination by light (L).