The present invention relates to a component carrier (1) comprising a stack having at least one electrically insulating layer structure (2) and/or at least one electrically conductive layer structure (3); a heat removing and electrically conductive base structure (4); a component (5) which is connected to the base structure (4) so as to at least partially protrude from the base structure (4) and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure (6) on or above a top main surface of the component (5). The present invention also relates to a method of manufacturing such a component carrier (1).