COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:EP3809805A1

    公开(公告)日:2021-04-21

    申请号:EP19203022.9

    申请日:2019-10-14

    摘要: The present invention relates to a component carrier (1) comprising a stack having at least one electrically insulating layer structure (2) and/or at least one electrically conductive layer structure (3); a heat removing and electrically conductive base structure (4); a component (5) which is connected to the base structure (4) so as to at least partially protrude from the base structure (4) and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure (6) on or above a top main surface of the component (5). The present invention also relates to a method of manufacturing such a component carrier (1).

    CONNECTION ARRANGEMENT, COMPONENT CARRIER AND METHOD OF FORMING A COMPONENT CARRIER STRUCTURE

    公开(公告)号:EP3793336A1

    公开(公告)日:2021-03-17

    申请号:EP19196363.6

    申请日:2019-09-10

    摘要: The present invention relates to a connection arrangement for forming a component carrier structure. The connection arrangement comprises a first electrically conductive connection element (1) and a second electrically conductive connection element (2). The first connection element (1) and the second connection element (2) are configured such that, upon connecting the first connection element (1) with the second connection element (2) along a connection direction (z), a form fit is established between the first connection element (1) and the second connection element (2) that limits a relative motion between the first connection element (1) and the second connection element (2) in a plane perpendicular to the connection direction (z). The present invention also relates to a component carrier and a method of forming a component carrier structure.

    BATCH MANUFACTURE OF COMPONENT CARRIERS
    9.
    发明公开

    公开(公告)号:EP3792960A2

    公开(公告)日:2021-03-17

    申请号:EP20204856.7

    申请日:2017-04-07

    摘要: A method of manufacturing a batch of component carriers (600), wherein the method comprises providing a plurality of separate wafer structures (400), each comprising a plurality of electronic components (402), simultaneously laminating the wafer structures (400) with at least one electrically conductive layer structure (300, 404, 500) and at least one electrically insulating layer structure (300, 404, 500), and singularizing a structure resulting from the laminating into the plurality of component carriers (600), each comprising at least one of the electronic components (402), a part of the at least one electrically conductive layer structure (300, 404, 500) and a part of the at least one electrically insulating layer structure (300, 404, 500).