It is described a method of manufacturing a component carrier (100). The method comprises (a) providing a core (110) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (b) attaching an electrically insulating layer (130) to the core (110); (c) attaching a protection layer (140) to the electrically insulating layer (130); (d) after attaching the protection layer (140), forming a hole (150) extending through the protection layer (140) and the electrically insulating layer (130); and (e) cleaning an interior of the hole (150) by dry etching (190a). It is further described a component carrier resulting from such the described method. The component carrier comprises a hole (150) formed within the electrically insulating layer (130). In a cross-sectional view of the component carrier (110) the hole (150) is laterally delimited by a slanted exterior sidewall portion (250a) and a slanted interior sidewall portion (250b) being angled with respect to the exterior sidewall portion (250a).