-
1.发明公开
公开(公告)号：EP3930429A1
公开(公告)日：2021-12-29
申请号：EP20181479.5
申请日：2020-06-22
IPC分类号： H05K1/18
摘要： A component carrier (100), wherein the component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106) and having a cavity (110) delimited at least partially by a first polymer (112), and a component (108) embedded in the cavity (110) of the stack (102) and being at least partially covered by a second polymer (114), wherein an anchoring interface (116) is formed at an interface between the first polymer (112) and the second polymer (114) at which the first polymer (112) and the second polymer (114) are mechanically anchored with each other.
-
公开(公告)号：EP3890456A1
公开(公告)日：2021-10-06
申请号：EP20167034.6
申请日：2020-03-31
摘要： It is described a method of manufacturing a component carrier (100). The method comprises (a) providing a core (110) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (b) attaching an electrically insulating layer (130) to the core (110); (c) attaching a protection layer (140) to the electrically insulating layer (130); (d) after attaching the protection layer (140), forming a hole (150) extending through the protection layer (140) and the electrically insulating layer (130); and (e) cleaning an interior of the hole (150) by dry etching (190a). It is further described a component carrier resulting from such the described method. The component carrier comprises a hole (150) formed within the electrically insulating layer (130). In a cross-sectional view of the component carrier (110) the hole (150) is laterally delimited by a slanted exterior sidewall portion (250a) and a slanted interior sidewall portion (250b) being angled with respect to the exterior sidewall portion (250a).
-
公开(公告)号：EP4093162A1
公开(公告)日：2022-11-23
申请号：EP21174488.3
申请日：2021-05-18
摘要： It is described a component carrier (100) comprising:
i) a stack (110) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (102);
ii) a magnetic element (150) assembled to the stack (110), wherein the magnetic element (150) comprises an embedded inductive element (120); and
iii) a dielectric layer structure (130) on the stack (110), wherein the dielectric layer structure (130) at least partially surrounds the magnetic element (150). Further, a manufacturing method and a use of photo-imaging are described.-
4.发明公开
公开(公告)号：EP3930428A1
公开(公告)日：2021-12-29
申请号：EP20181475.3
申请日：2020-06-22
IPC分类号： H05K1/18
摘要： A component carrier (100) which comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a component (108) embedded in the stack (102), and a functional film (110) covering at least part of the component (108) and having an inhomogeneous thickness distribution over at least part of a surface of the component (108).
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
