发明公开
- 专利标题： COPPER BONDING WIRE
-
申请号： EP21757478.9申请日： 2021-02-19
-
公开(公告)号： EP4109499A1公开(公告)日： 2022-12-28
- 发明人: UNO, Tomohiro , OYAMADA, Tetsuya , ODA, Daizo , SHIMOMURA, Kota , YAMAGUCHI, Tadashi
- 申请人： Nippon Micrometal Corporation , NIPPON STEEL Chemical & Material Co., Ltd.
- 申请人地址： JP Iruma-shi Saitama 358-0032 158-1, Oaza-Sayamagahara; JP Tokyo 103-0027 13-1, Nihonbashi 1-chome, Chuo-ku,
- 代理机构： Vossius & Partner Patentanwälte Rechtsanwälte mbB
- 优先权： JP2020028560 20200221
- 国际公布： WO2021167083 20210826
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
There is provided a copper bonding wire that exhibits a favorable bondability even when a scrub at the time of bonding is reduced. The copper bonding wire is characterized in that when a sum of percentages of Cu, Cu 2 O, CuO and Cu(OH) 2 on a surface of the wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, Cu[II]/Cu[I] which is a ratio of a total percentage of CuO and Cu(OH) 2 (Cu[II]) corresponding to bivalent Cu to a percentage of Cu 2 O (Cu[I]) corresponding to monovalent Cu falls within a range from 0.8 to 12.
信息查询
IPC分类:
