This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer (1), a chip (2), a package body (4), and a connecting assembly (5). The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad (21) on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly. The chip in the package structure is coupled to the package base layer in a mounting manner, and a signal of the chip may be led out to the surface of the package body through the connecting assembly without using pins. This facilitates reduction of a size of the package structure and facilitates implementation of a small size of the package structure. In addition, a structure of the connecting assembly facilitates shortening of a wiring path of a wire bond, so that a possible parasitic effect of the wire bond can be reduced.