- 专利标题： WIRE BONDED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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申请号： EP22198870.2申请日： 2022-09-29
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公开(公告)号： EP4163966A1公开(公告)日： 2023-04-12
- 发明人: GE, You , LYE, Meng Kong , WANG, Zhijie
- 申请人： NXP USA, Inc.
- 申请人地址： US Austin TX 78735 6501 William Cannon Drive
- 代理机构： Schmütz, Christian Klaus Johannes
- 优先权： CN202111184282 20211011
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L23/31 ; H01L21/60
摘要：
A method of packaging a semiconductor device includes: bonding a ball (304) at an end of a bond wire (302) to a bond pad (204) of a semiconductor device die (200) in an aperture of a shielding layer (206) of the semiconductor device; and sealing the part of the bond pad (204) exposed by the aperture of the shielding layer (206) by deforming the ball (304) of the bond wire (302) to fill the aperture of the shielding layer (206). The aperture of the shielding layer (206) includes an edge wall, and exposes a part of the bond pad (204). The shielding layer (206) covers a remaining part of the bond pad (204). The aperture of the shielding layer (206) is completely filled with the ball (304) of the bond wire (302), thereby deforming the edge wall of the shielding layer (206).
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