Substrate arrangement for a micro display, the substrate arrangement comprising a semiconductor substrate, a back end of line (BEOL) stack, wherein the BEOL stack is arranged on the semiconductor substrate and wherein the BEOL stack comprises a plurality of structured wiring layers, an insulating material structure (IMS), and a recess in the IMS, wherein the plurality of structured wiring layers are stacked and embedded in the insulating material structure, and wherein an upmost structured wiring layer of the plurality of structured wiring layers comprises a plurality of contact pads, and wherein the recess extends to a first set of contact pads of the plurality of contact pads; and a conductive layer, having a metallic material, on the surface of the BEOL stack, wherein the conductive layer comprises a first, structured portion comprising a contact pad array and wherein the conductive layer comprises a second portion that is arranged on the first set of contact pads of the BEOL stack , and wherein the first portion of the conductive layer is electrically separated from the second portion of the conductive layer; and wherein the first set of contact pads of the BEOL stack and the second portion of the conductive layer are configured to form recessed wire-bond pads.