- 专利标题： METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
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申请号： EP24157517.4申请日： 2016-07-12
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公开(公告)号： EP4345142A2公开(公告)日： 2024-04-03
- 发明人: LAM, Viet , CUI, Ji
- 申请人： CMC Materials LLC
- 申请人地址： US Wilmington, DE 19801 Corporation Trust Center 1209 Orange Street
- 代理机构： Barker Brettell LLP
- 优先权： US201562191824 P 20150713
- 主分类号： C09G1/02
- IPC分类号： C09G1/02
摘要：
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.
公开/授权文献
- EP4345142A3 METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE 公开/授权日：2024-05-29
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