专利检索 ap:("CMC Materials LLC") AND inv:"LAM, Viet" 第 1 页

1.

发明公开
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE 审中-实审

公开(公告)号：EP4345142A2

公开(公告)日：2024-04-03

申请号：EP24157517.4

申请日：2016-07-12

申请人： CMC Materials LLC

发明人： LAM, Viet , CUI, Ji

IPC分类号： C09G1/02

摘要： Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.

2.

发明公开
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE 审中-实审

公开(公告)号：EP4345142A3

公开(公告)日：2024-05-29

申请号：EP24157517.4

申请日：2016-07-12

申请人： CMC Materials LLC

发明人： LAM, Viet , CUI, Ji

IPC分类号： H01L21/304 , B24B57/02 , H01L21/306 , C09G1/02

CPC分类号： B24B37/044 , C09G1/02

摘要： Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.