A circuit board module according to various embodiments of the present disclosure may comprise: a first substrate; a second substrate including a first opening and disposed over the first substrate; an interposer disposed between the first substrate and the second substrate to connect the first substrate and the second substrate and providing a first space between the first substrate and the second substrate; a sealing member attached to cover the first opening; and a filler disposed between the first substrate and the second substrate, wherein the sealing member includes an insertion area in which a filler insertion nozzle is inserted into the first opening, and a second opening through which air is introduced into the first space and a third opening through which air is discharged from the first space are formed through at least one of the first substrate, the second substrate, and the interposer.