公开(公告)号：EP4376565A1

公开(公告)日：2024-05-29

申请号：EP22856177.5

申请日：2022-08-09

申请人： Samsung Electronics Co., Ltd.

发明人： CHO, Yonglak ,  KIM, Joohan ,  KIM, Juho ,  PARK, Min ,  PARK, Eunsoo ,  AN, Insun ,  LEE, Byungwoo ,  LEE, Sangtae ,  LEE, Haejin

IPC分类号： H05K7/20 ,  H05K1/11 ,  H05K3/46

CPC分类号： H05K7/20 ,  H05K1/11 ,  H05K3/46

摘要： A circuit board module according to various embodiments of the present disclosure may comprise: a first substrate; a second substrate including a first opening and disposed over the first substrate; an interposer disposed between the first substrate and the second substrate to connect the first substrate and the second substrate and providing a first space between the first substrate and the second substrate; a sealing member attached to cover the first opening; and a filler disposed between the first substrate and the second substrate, wherein the sealing member includes an insertion area in which a filler insertion nozzle is inserted into the first opening, and a second opening through which air is introduced into the first space and a third opening through which air is discharged from the first space are formed through at least one of the first substrate, the second substrate, and the interposer.