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公开(公告)号：EP3697185A1
公开(公告)日：2020-08-19
申请号：EP18886956.4
申请日：2018-12-05
发明人： JO, Jeonggyu , RHEE, Bongjae , KIM, Joohan , SIM, Bokyung , LEE, Yongwon , JUNG, Daekwang , CHO, Chihyun
IPC分类号： H05K9/00 , H05K1/02 , G02F1/1333 , G01H17/00
摘要： Disclosed is an electronic device. The electronic device according to an embodiment includes a display panel including a plurality of pixels, a display driver IC that is electrically connected with the display panel and that displays contents using the plurality of pixels, a support structure disposed under one surface of the display panel and having an opening part formed therein through which a partial area of the one surface is exposed, a shielding structure disposed under at least part of the partial area of the display exposed through the opening part, the shielding structure being electrically connected with a ground area provided in the electronic device so as to block noise generated from the display panel driven by the display driver IC, and an ultrasonic sensor disposed under at least part of the shielding structure. Besides, it may be permissible to prepare various other embodiments speculated through the specification.
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公开(公告)号：EP4376565A1
公开(公告)日：2024-05-29
申请号：EP22856177.5
申请日：2022-08-09
发明人： CHO, Yonglak , KIM, Joohan , KIM, Juho , PARK, Min , PARK, Eunsoo , AN, Insun , LEE, Byungwoo , LEE, Sangtae , LEE, Haejin
摘要： A circuit board module according to various embodiments of the present disclosure may comprise: a first substrate; a second substrate including a first opening and disposed over the first substrate; an interposer disposed between the first substrate and the second substrate to connect the first substrate and the second substrate and providing a first space between the first substrate and the second substrate; a sealing member attached to cover the first opening; and a filler disposed between the first substrate and the second substrate, wherein the sealing member includes an insertion area in which a filler insertion nozzle is inserted into the first opening, and a second opening through which air is introduced into the first space and a third opening through which air is discharged from the first space are formed through at least one of the first substrate, the second substrate, and the interposer.
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3.发明公开
公开(公告)号：EP3940504A1
公开(公告)日：2022-01-19
申请号：EP21195327.8
申请日：2019-04-17
发明人： JO, Jeonggyu , KIM, Joohan , KIM, Jinman , SIM, Bokyung , RHEE, Bongjae , LEE, Yongwon , JUNG, Daekwang
摘要： An electronic device includes a display including a first surface facing a first direction to output display information and a second surface facing a second direction opposite the first direction, a biometric sensor including a sensing surface disposed to face a partial area of the second surface of the display and a side surface formed in a lateral direction, a first fixing member interposed between the partial area of the second surface and the biometric sensor such that the sensing surface is attached to the partial area of the second surface, and hardened at a specified temperature, and a second fixing member attached to at least a portion of the side surface and at least a portion of a peripheral area adjacent to the partial area of the second surface and hardened by light of a specified wavelength.
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4.发明公开
公开(公告)号：EP4235467A2
公开(公告)日：2023-08-30
申请号：EP23177546.1
申请日：2018-11-28
发明人： KIM, Jinman , KIM, Joohan , RHEE, Bongjae , JO, Jeonggyu , KOO, Hyojun , WOO, Sunggwan , CHOI, Hyunsuk
IPC分类号： G06F21/32
摘要： An electronic device is provided according to embodiments of the present disclosure, including: a transparent member; a display panel disposed under the transparent member; an ultrasonic sensor disposed under the display panel and configured to acquire biometric information from an external object touched on the transparent member by using an ultrasonic wave having been transmitted through the display panel and the transparent member; and a light absorbing member disposed between the display panel and the ultrasonic sensor, and configured to absorb at least a part of external light incident into the ultrasonic sensor through the transparent member and the display panel, wherein the ultrasonic sensor includes an ultrasonic wave receiver for receiving the ultrasonic wave reflected from the external object, and at least a part of the ultrasonic wave receiver is disposed in close contact with the light absorbing member.
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5.发明公开
公开(公告)号：EP4235467A3
公开(公告)日：2023-10-25
申请号：EP23177546.1
申请日：2018-11-28
发明人： KIM, Jinman , KIM, Joohan , RHEE, Bongjae , JO, Jeonggyu , KOO, Hyojun , WOO, Sunggwan , CHOI, Hyunsuk
摘要： An electronic device is provided according to embodiments of the present disclosure, including: a transparent member; a display panel disposed under the transparent member; an ultrasonic sensor disposed under the display panel and configured to acquire biometric information from an external object touched on the transparent member by using an ultrasonic wave having been transmitted through the display panel and the transparent member; and a light absorbing member disposed between the display panel and the ultrasonic sensor, and configured to absorb at least a part of external light incident into the ultrasonic sensor through the transparent member and the display panel, wherein the ultrasonic sensor includes an ultrasonic wave receiver for receiving the ultrasonic wave reflected from the external object, and at least a part of the ultrasonic wave receiver is disposed in close contact with the light absorbing member.
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公开(公告)号：EP3952622A1
公开(公告)日：2022-02-09
申请号：EP20777072.8
申请日：2020-03-19
发明人： LEE, Yongwon , KIM, Jeonghoo , KIM, Joohan , RHEE, Bongjae , YANG, Seyoung , JANG, Seyoung
摘要： Described are various embodiments related to a circuit board included in an electronic device. According to an embodiment, the circuit board includes: a first circuit board, on which at least one circuit element or at least one first electronic component included in an electronic device, is mounted; a second circuit board, on which at least one second electronic component included in the electronic device, is mounted; and a connection structure electrically connecting the first circuit board and the second circuit board through soldering. The connection structure includes: a first connection terminal disposed on the first circuit board and including at least one first connection pad; and a second connection terminal disposed on the second circuit board and including at least one second connection pad. The at least one second connection pad faces the at least one first connection pad and is electrically connected to the at least one first connection pad through the soldering. The at least one second connection pad may include a plurality of contact members which are in surface contact with a solder provided by the soldering. Various other embodiments are possible.
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7.发明公开
公开(公告)号：EP3716008A1
公开(公告)日：2020-09-30
申请号：EP18883518.5
申请日：2018-11-28
发明人： KIM, Jinman , KIM, Joohan , RHEE, Bongjae , JO, Jeonggyu , KOO, Hyojun , WOO, Sunggwan , CHOI, Hyunsuk
摘要： An electronic device according to one embodiment of the present disclosure comprises: a transparent member; a display panel arranged below the transparent member; an ultrasonic sensor, arranged below the display panel, for acquiring biometric information by using ultrasonic waves having passed through the display panel and the transparent member for an external object close to the transparent member; and a light absorbing member for absorbing, through the transparent member and the display panel, at least a part of external light incident on the ultrasonic sensor, wherein the light absorbing member can be arranged between the display panel and the ultrasonic sensor. Other various examples are possible.
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