- 专利标题： METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON, APPARATUS AND DEVICE
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申请号： EP24150220.2申请日： 2024-01-03
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公开(公告)号： EP4411814A1公开(公告)日： 2024-08-07
- 发明人: MAZZOLA, Mauro , MARCHISI, Fabio
- 申请人： STMicroelectronics International N.V.
- 申请人地址： CH 1228 Plan-les-Ouates, Geneva Chemin du Champ des Filles 39
- 专利权人： STMicroelectronics International N.V.
- 当前专利权人： STMicroelectronics International N.V.
- 当前专利权人地址： CH 1228 Plan-les-Ouates, Geneva Chemin du Champ des Filles 39
- 代理机构： Bosotti, Luciano
- 优先权： IT 2300000849 2023.01.20
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00
摘要：
A semiconductor die (14) is arranged at a die mounting location (12A) of a substrate (12). The substrate (12) comprises an array of electrically conductive leads (12B) at the periphery of the substrate (12) .
Electrical coupling is provided between the semiconductor die (14) and selected ones of the electrically conductive leads (12B) in the array of electrically conductive leads (12B) via electrically conductive ribbons (20) having a body portion (200) having a first width (W1) as well as first and second end portions (201) bonded to the semiconductor die (14) and to the electrically conductive leads (12B), respectively.
At least one of the first and second end portions (201) of the electrically conductive ribbons (20) comprises a tapered portion having a second width (W2) smaller than the first width (W1) of the body portion (200) .
Electrical coupling is provided between the semiconductor die (14) and selected ones of the electrically conductive leads (12B) in the array of electrically conductive leads (12B) via electrically conductive ribbons (20) having a body portion (200) having a first width (W1) as well as first and second end portions (201) bonded to the semiconductor die (14) and to the electrically conductive leads (12B), respectively.
At least one of the first and second end portions (201) of the electrically conductive ribbons (20) comprises a tapered portion having a second width (W2) smaller than the first width (W1) of the body portion (200) .
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