公开(公告)号：EP4411814A1

公开(公告)日：2024-08-07

申请号：EP24150220.2

申请日：2024-01-03

申请人： STMicroelectronics International N.V.

发明人： MAZZOLA, Mauro ,  MARCHISI, Fabio

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/4024720130101 ,  H01L2224/4024820130101 ,  H01L2224/4024920130101 ,  H01L2224/3701320130101 ,  H01L2224/400520130101 ,  H01L2224/400720130101 ,  H01L24/48 ,  H01L24/743

摘要： A semiconductor die (14) is arranged at a die mounting location (12A) of a substrate (12). The substrate (12) comprises an array of electrically conductive leads (12B) at the periphery of the substrate (12) .
Electrical coupling is provided between the semiconductor die (14) and selected ones of the electrically conductive leads (12B) in the array of electrically conductive leads (12B) via electrically conductive ribbons (20) having a body portion (200) having a first width (W1) as well as first and second end portions (201) bonded to the semiconductor die (14) and to the electrically conductive leads (12B), respectively.
At least one of the first and second end portions (201) of the electrically conductive ribbons (20) comprises a tapered portion having a second width (W2) smaller than the first width (W1) of the body portion (200) .