CHARGED PARTICLE-OPTICAL ELEMENT, CHARGED PARTICLE-OPTICAL MODULE, ASSESSMENT APPARATUS, CHIP ASSEMBLY, METHOD OF MANUFACTURING
摘要:
A charged particle-optical element is disclosed. The element is for a charged particle-optical module configured to direct charged particles along at least one beam path towards a sample. In one arrangement, the element comprises a chip comprising an integrated circuit 64 formed in a semiconductor substrate 61. The substrate defines at least one aperture 63 for passage therethrough of the at least one beam path. A size of the substrate exceeds a die-size of a lithographic imaging system used during manufacturing of the integrated circuit.
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